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- 1.2210003 date "Jul–Aug 2006".
- 1.2210003 doi "10.1116/1.2210003".
- 1.2210003 first1 "Parthiban".
- 1.2210003 first2 "Harold D.".
- 1.2210003 first3 "Bahgat G.".
- 1.2210003 isCitedBy Bahgat_G._Sammakia.
- 1.2210003 issue "4".
- 1.2210003 journal Journal_of_Vacuum_Science_and_Technology_B.
- 1.2210003 last "Arunasalam P, Ackler HD, Sammakia BG".
- 1.2210003 last2 "Ackler".
- 1.2210003 last3 "Sammakia".
- 1.2210003 pages "1780–1784".
- 1.2210003 title "Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks".
- 1.2210003 volume "24".