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- 6144.926381 date "June 2001".
- 6144.926381 doi "10.1109/6144.926381".
- 6144.926381 first1 "S.P.".
- 6144.926381 first2 "B.T.".
- 6144.926381 first3 "B.G.".
- 6144.926381 isCitedBy Bahgat_G._Sammakia.
- 6144.926381 issue "2".
- 6144.926381 journal "IEEE Transactions on Components and Packaging Technologies".
- 6144.926381 last "Watson SP, Murray BT, Sammakia BG".
- 6144.926381 last2 "Murray".
- 6144.926381 last3 "Sammakia".
- 6144.926381 pages "184–190".
- 6144.926381 publisher "IEEE".
- 6144.926381 title "Computational parameter study of chip scale package array cooling".
- 6144.926381 url 00926381.pdf?tp=&arnumber=926381&isnumber=20041.
- 6144.926381 volume "24".