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- 6144.814967 date "December 1999".
- 6144.814967 doi "10.1109/6144.814967".
- 6144.814967 first1 "S.K.".
- 6144.814967 first2 "D.L.".
- 6144.814967 first3 "B.G.".
- 6144.814967 isCitedBy Bahgat_G._Sammakia.
- 6144.814967 issue "4".
- 6144.814967 journal "IEEE Transactions on Components and Packaging Technologies".
- 6144.814967 last "Tran SK, Questad DL, Sammakia BG".
- 6144.814967 last2 "Questad".
- 6144.814967 last3 "Sammakia".
- 6144.814967 pages "519–524".
- 6144.814967 publisher "IEEE".
- 6144.814967 title "Adhesion issues in flip-chip on organic modules".
- 6144.814967 url 00814967.pdf?tp=&arnumber=814967&isnumber=17642.
- 6144.814967 volume "22".