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- 6144.814962 date "December 1999".
- 6144.814962 doi "10.1109/6144.814962".
- 6144.814962 first2 "B.G.".
- 6144.814962 first3 "S.".
- 6144.814962 isCitedBy Bahgat_G._Sammakia.
- 6144.814962 issue "4".
- 6144.814962 journal "IEEE Transactions on Components and Packaging Technologies".
- 6144.814962 last "Niu TM, Sammakia BG, Sathe S".
- 6144.814962 last2 "Sammakia".
- 6144.814962 last3 "Sathe".
- 6144.814962 pages "484–487".
- 6144.814962 publisher "IEEE".
- 6144.814962 title "Void-effect modeling of flip-chip encapsulation on ceramic substrate".
- 6144.814962 url 00814962.pdf?tp=&arnumber=814962&isnumber=17642.
- 6144.814962 volume "22".