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- Q570628 subject Q6967792.
- Q570628 abstract "A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.".
- Q570628 thumbnail BGA_RAM.jpg?width=300.
- Q570628 wikiPageExternalLink index.cfm?objectid=43744A6D-5056-AA0A-E2A3D44CFFBA9C22.
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- Q570628 wikiPageWikiLink Q6967792.
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- Q570628 comment "A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.".
- Q570628 label "Ball grid array".
- Q570628 depiction BGA_RAM.jpg.
