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- Thermocompression_bonding abstract "Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold (Au)-gold (Au), are brought into atomic contact applying force and heat simultaneously. The diffusion requires atomic contact between the surfaces due to the atomic motion. The atoms migrate from one crystal lattice to the other one based on crystal lattice vibration. This atomic interaction sticks the interface together.The diffusion process is described by the following three processes: surface diffusion grain boundary diffusion bulk diffusionThis method enables internal structure protecting device packages and direct electrical interconnect structures without additional steps beside the surface mounting process.".
- Thermocompression_bonding wikiPageID "26384121".
- Thermocompression_bonding wikiPageLength "13104".
- Thermocompression_bonding wikiPageOutDegree "60".
- Thermocompression_bonding wikiPageRevisionID "656273619".
- Thermocompression_bonding wikiPageWikiLink Accelerometer.
- Thermocompression_bonding wikiPageWikiLink Aluminium.
- Thermocompression_bonding wikiPageWikiLink Brittleness.
- Thermocompression_bonding wikiPageWikiLink CMOS.
- Thermocompression_bonding wikiPageWikiLink Category:Electronics_manufacturing.
- Thermocompression_bonding wikiPageWikiLink Category:Packaging_(microfabrication).
- Thermocompression_bonding wikiPageWikiLink Category:Semiconductor_technology.
- Thermocompression_bonding wikiPageWikiLink Category:Wafer_bonding.
- Thermocompression_bonding wikiPageWikiLink Cavitation.
- Thermocompression_bonding wikiPageWikiLink Chemical-mechanical_planarization.
- Thermocompression_bonding wikiPageWikiLink Compliant_bonding.
- Thermocompression_bonding wikiPageWikiLink Copper.
- Thermocompression_bonding wikiPageWikiLink Copper_interconnect.
- Thermocompression_bonding wikiPageWikiLink Crystal_structure.
- Thermocompression_bonding wikiPageWikiLink Density.
- Thermocompression_bonding wikiPageWikiLink Diffusion.
- Thermocompression_bonding wikiPageWikiLink Diffusion_barrier.
- Thermocompression_bonding wikiPageWikiLink Diffusion_bonding.
- Thermocompression_bonding wikiPageWikiLink Dry_etching.
- Thermocompression_bonding wikiPageWikiLink Ductility.
- Thermocompression_bonding wikiPageWikiLink Electroplating.
- Thermocompression_bonding wikiPageWikiLink Etching_(microfabrication).
- Thermocompression_bonding wikiPageWikiLink Evaporation.
- Thermocompression_bonding wikiPageWikiLink Fixture_(tool).
- Thermocompression_bonding wikiPageWikiLink Formic_acid.
- Thermocompression_bonding wikiPageWikiLink Forming_gas.
- Thermocompression_bonding wikiPageWikiLink Gold.
- Thermocompression_bonding wikiPageWikiLink Grain_boundary.
- Thermocompression_bonding wikiPageWikiLink Gyroscope.
- Thermocompression_bonding wikiPageWikiLink Hermetic_seal.
- Thermocompression_bonding wikiPageWikiLink Impurity.
- Thermocompression_bonding wikiPageWikiLink Interface_(chemistry).
- Thermocompression_bonding wikiPageWikiLink Molecular_diffusion.
- Thermocompression_bonding wikiPageWikiLink Motion_(physics).
- Thermocompression_bonding wikiPageWikiLink Nitride.
- Thermocompression_bonding wikiPageWikiLink Oxide.
- Thermocompression_bonding wikiPageWikiLink Passivation_(chemistry).
- Thermocompression_bonding wikiPageWikiLink Plasma_(physics).
- Thermocompression_bonding wikiPageWikiLink Pressure_sensor.
- Thermocompression_bonding wikiPageWikiLink Redox.
- Thermocompression_bonding wikiPageWikiLink Sputtering.
- Thermocompression_bonding wikiPageWikiLink Surface.
- Thermocompression_bonding wikiPageWikiLink Surface_diffusion.
- Thermocompression_bonding wikiPageWikiLink Thermal_conduction.
- Thermocompression_bonding wikiPageWikiLink Thermal_expansion.
- Thermocompression_bonding wikiPageWikiLink Tin.
- Thermocompression_bonding wikiPageWikiLink Vacuum.
- Thermocompression_bonding wikiPageWikiLink Vapor.
- Thermocompression_bonding wikiPageWikiLink Vapor-compression_evaporation.
- Thermocompression_bonding wikiPageWikiLink Wafer_(electronics).
- Thermocompression_bonding wikiPageWikiLink Wafer_bonding.
- Thermocompression_bonding wikiPageWikiLink Wavelength.
- Thermocompression_bonding wikiPageWikiLink File:B-tc-tisibondinginterface.png.
- Thermocompression_bonding wikiPageWikiLinkText "Thermocompression bonding".
- Thermocompression_bonding wikiPageWikiLinkText "thermocompression bonding".
- Thermocompression_bonding wikiPageUsesTemplate Template:Wafer_bonding.
- Thermocompression_bonding subject Category:Electronics_manufacturing.
- Thermocompression_bonding subject Category:Packaging_(microfabrication).
- Thermocompression_bonding subject Category:Semiconductor_technology.
- Thermocompression_bonding subject Category:Wafer_bonding.
- Thermocompression_bonding comment "Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold (Au)-gold (Au), are brought into atomic contact applying force and heat simultaneously. The diffusion requires atomic contact between the surfaces due to the atomic motion. The atoms migrate from one crystal lattice to the other one based on crystal lattice vibration.".
- Thermocompression_bonding label "Thermocompression bonding".
- Thermocompression_bonding sameAs Q1111341.
- Thermocompression_bonding sameAs Thermokompressionsschweißen.
- Thermocompression_bonding sameAs m.0gkzg7t.
- Thermocompression_bonding sameAs Q1111341.
- Thermocompression_bonding wasDerivedFrom Thermocompression_bonding?oldid=656273619.
- Thermocompression_bonding isPrimaryTopicOf Thermocompression_bonding.