Matches in DBpedia 2016-04 for { <http://dbpedia.org/resource/Stencil_printing> ?p ?o }
Showing triples 1 to 38 of
38
with 100 triples per page.
- Stencil_printing abstract "Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately followed by the component placement stage. The equipment and materials used in this stage are stencil, solder paste, and a printer.The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components to stay in place. A good solder joint is one where the solder paste has melted well and flowed and wetted the lead or termination on the component and the pad on the board.In order to achieve this kind of a solder joint, the component needs to be in the right place, the right volume of solder paste needs to be applied, the paste needs to wet well on the board and component, and there needs to be a residue that is either safe to leave on the board or one that can easily be cleaned.The solder volume is a function of the stencil, the printing process and equipment, solder powder, and rheology or the physical properties of the paste. Good solder wetting is a function of the flux.".
- Stencil_printing wikiPageExternalLink 1328395402.
- Stencil_printing wikiPageExternalLink 0222_print.
- Stencil_printing wikiPageExternalLink SMTA_India_05_SMTA_Presentation_Workshop_on_SMT_Stencil(R1).pdf.
- Stencil_printing wikiPageExternalLink book_detail.cfm?book_id=436.
- Stencil_printing wikiPageID "42870676".
- Stencil_printing wikiPageLength "18499".
- Stencil_printing wikiPageOutDegree "12".
- Stencil_printing wikiPageRevisionID "701649305".
- Stencil_printing wikiPageWikiLink Adhesive.
- Stencil_printing wikiPageWikiLink Category:Printed_circuit_board_manufacturing.
- Stencil_printing wikiPageWikiLink Category:Printing_processes.
- Stencil_printing wikiPageWikiLink Electroforming.
- Stencil_printing wikiPageWikiLink Fiducial_mark.
- Stencil_printing wikiPageWikiLink Flux_(metallurgy).
- Stencil_printing wikiPageWikiLink Printed_circuit_board.
- Stencil_printing wikiPageWikiLink Solder_paste.
- Stencil_printing wikiPageWikiLink Soldering.
- Stencil_printing wikiPageWikiLink Squeegee.
- Stencil_printing wikiPageWikiLink Stencil.
- Stencil_printing wikiPageWikiLinkText "Stencil printing".
- Stencil_printing wikiPageUsesTemplate Template:Howto.
- Stencil_printing wikiPageUsesTemplate Template:Multiple_issues.
- Stencil_printing wikiPageUsesTemplate Template:No_footnotes.
- Stencil_printing wikiPageUsesTemplate Template:Orphan.
- Stencil_printing wikiPageUsesTemplate Template:Overly_detailed.
- Stencil_printing wikiPageUsesTemplate Template:Reflist.
- Stencil_printing subject Category:Printed_circuit_board_manufacturing.
- Stencil_printing subject Category:Printing_processes.
- Stencil_printing hypernym Process.
- Stencil_printing type Election.
- Stencil_printing comment "Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately followed by the component placement stage. The equipment and materials used in this stage are stencil, solder paste, and a printer.The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow.".
- Stencil_printing label "Stencil printing".
- Stencil_printing sameAs Q18385389.
- Stencil_printing sameAs m.010qmxx5.
- Stencil_printing sameAs Q18385389.
- Stencil_printing wasDerivedFrom Stencil_printing?oldid=701649305.
- Stencil_printing isPrimaryTopicOf Stencil_printing.