Matches in DBpedia 2016-04 for { <http://dbpedia.org/resource/Product_teardown> ?p ?o }
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- Product_teardown abstract "A product teardown, or simply teardown, is the act of disassembling a product, such as a television set, to identify its component parts, chip & system functionality, and component costing information. For products having 'secret' technology, such as the Mikoyan-Gurevich MiG-25, the process may be secret. For others, including consumer electronics, the results are typically disseminated through photographs and component lists so that others can make use of the information without having to disassemble the product themselves. This information is important to designers of semiconductors, displays, batteries, packaging companies, integrated design firms, and semiconductor fabs, and the systems they operate within.This information can be of interest to hobbyists, but can also be used commercially by the technical community to find out, for example, what semiconductor components are being utilized in consumer electronic products, such as the Wii video game console or Apple's iPhone. Such knowledge can aid understanding of how the product works, including innovative design features, and can facilitate estimating the bill of materials (BOM). The financial community therefore has an interest in teardowns, as knowing how a company's products are built can help guide a stock valuation. Manufacturers are often not allowed to announce what components are present in a product due to non-disclosure agreements (NDA). Teardowns also play a part in evidence of use in court and litigation proceedings where a companies parts may have been used without their permission, counterfeited, or to show where intellectual property or patents might be infringed by another firms part or system.Identifying semiconductor components in systems has become more difficult over the past years. The most notable change started with Apple's 8GB iPod nano, were repackaged with Apple branding.This makes it more difficult to identify the actual device manufacturer and function of the component without performing a 'decap' – removing the outer packaging to analyze the die within. Typically there are markings on the die inside the package that can lead experienced engineers to see who actually created the device and what functionality it performs in the system.Teardowns have also been performed in front of a live studio audience at the Embedded Systems Conference (ESC). The first live teardown was performed on a Toyota Prius at the Embedded Systems Conference in San Jose, April 2006. Since that time, additional live teardowns have been performed, most recently being the Sony OLED TV, Gibson Self-Tuning Guitar, SuitSat space suit, and Sony Rolly MP3 player.Major companies that publicize their teardowns include Portelligent and Semiconductor Insights, both of which write featured articles in EETimes and TechOnline on their findings. The two companies were merged to form TechInsights, headquartered in Canada. ABI Research also provides teardowns for all major mobile devices and components in their Device Portal. Other websites offer user-contributed teardown information at no cost.".
- Product_teardown wikiPageExternalLink teardown.
- Product_teardown wikiPageExternalLink www.teardown.com.
- Product_teardown wikiPageExternalLink www.techinsights.com.
- Product_teardown wikiPageExternalLink teardowns.
- Product_teardown wikiPageExternalLink www.takeitapart.com.
- Product_teardown wikiPageID "17062218".
- Product_teardown wikiPageLength "4140".
- Product_teardown wikiPageOutDegree "16".
- Product_teardown wikiPageRevisionID "701300849".
- Product_teardown wikiPageWikiLink ABI_Research.
- Product_teardown wikiPageWikiLink Apple_Inc..
- Product_teardown wikiPageWikiLink Bill_of_materials.
- Product_teardown wikiPageWikiLink Category:Products.
- Product_teardown wikiPageWikiLink Category:Technology.
- Product_teardown wikiPageWikiLink Consumer_electronics.
- Product_teardown wikiPageWikiLink Die_(integrated_circuit).
- Product_teardown wikiPageWikiLink EE_Times.
- Product_teardown wikiPageWikiLink IFixit.
- Product_teardown wikiPageWikiLink IPhone.
- Product_teardown wikiPageWikiLink Mikoyan-Gurevich_MiG-25.
- Product_teardown wikiPageWikiLink Non-disclosure_agreement.
- Product_teardown wikiPageWikiLink Reverse_engineering.
- Product_teardown wikiPageWikiLink SuitSat.
- Product_teardown wikiPageWikiLink TechInsights.
- Product_teardown wikiPageWikiLink Wii.
- Product_teardown wikiPageWikiLinkText "Product teardown".
- Product_teardown wikiPageWikiLinkText "Product teardowns".
- Product_teardown wikiPageWikiLinkText "product teardown".
- Product_teardown wikiPageWikiLinkText "teardown".
- Product_teardown wikiPageWikiLinkText "teardowns".
- Product_teardown wikiPageUsesTemplate Template:Reflist.
- Product_teardown subject Category:Products.
- Product_teardown subject Category:Technology.
- Product_teardown hypernym Act.
- Product_teardown type Band.
- Product_teardown type Work.
- Product_teardown type Classification.
- Product_teardown type Good.
- Product_teardown type Science.
- Product_teardown type Work.
- Product_teardown comment "A product teardown, or simply teardown, is the act of disassembling a product, such as a television set, to identify its component parts, chip & system functionality, and component costing information. For products having 'secret' technology, such as the Mikoyan-Gurevich MiG-25, the process may be secret.".
- Product_teardown label "Product teardown".
- Product_teardown sameAs Q7247796.
- Product_teardown sameAs m.04173mp.
- Product_teardown sameAs Q7247796.
- Product_teardown wasDerivedFrom Product_teardown?oldid=701300849.
- Product_teardown isPrimaryTopicOf Product_teardown.