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- Molded_interconnect_device abstract "A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part through selective metallization.".
- Molded_interconnect_device wikiPageExternalLink mid.
- Molded_interconnect_device wikiPageExternalLink content.cfm?context=markten&content=product&laag1=181&laag2=145&item_id=232&Taal=2.
- Molded_interconnect_device wikiPageID "23876638".
- Molded_interconnect_device wikiPageLength "4471".
- Molded_interconnect_device wikiPageOutDegree "9".
- Molded_interconnect_device wikiPageRevisionID "707984116".
- Molded_interconnect_device wikiPageWikiLink 1,3-Butadiene.
- Molded_interconnect_device wikiPageWikiLink Category:Electrical_signal_connectors.
- Molded_interconnect_device wikiPageWikiLink Coating.
- Molded_interconnect_device wikiPageWikiLink Electronic_circuit.
- Molded_interconnect_device wikiPageWikiLink Electronics.
- Molded_interconnect_device wikiPageWikiLink Injection_moulding.
- Molded_interconnect_device wikiPageWikiLink LPKF_Laser_&_Electronics.
- Molded_interconnect_device wikiPageWikiLink Polycarbonate.
- Molded_interconnect_device wikiPageWikiLink Thermoplastic.
- Molded_interconnect_device wikiPageWikiLinkText "Molded interconnect device".
- Molded_interconnect_device wikiPageWikiLinkText "molded interconnect device#Laser Direct Structuring (LDS)".
- Molded_interconnect_device wikiPageUsesTemplate Template:Primary_sources.
- Molded_interconnect_device wikiPageUsesTemplate Template:Reflist.
- Molded_interconnect_device subject Category:Electrical_signal_connectors.
- Molded_interconnect_device hypernym Part.
- Molded_interconnect_device type Connector.
- Molded_interconnect_device type Protocol.
- Molded_interconnect_device type Redirect.
- Molded_interconnect_device comment "A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part through selective metallization.".
- Molded_interconnect_device label "Molded interconnect device".
- Molded_interconnect_device sameAs Q1943354.
- Molded_interconnect_device sameAs Molded_Interconnect_Devices.
- Molded_interconnect_device sameAs m.076ydpn.
- Molded_interconnect_device sameAs Q1943354.
- Molded_interconnect_device wasDerivedFrom Molded_interconnect_device?oldid=707984116.
- Molded_interconnect_device isPrimaryTopicOf Molded_interconnect_device.