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- Adhesive_bonding abstract "Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different materials. These produced connections can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially the well-established SU-8, and benzocyclobutene (BCB), are specialized for MEMS or electronic component production.The procedure enables bonding temperatures from 1000 °C down to room temperature. The most important process parameters for achieving a high bonding strength are: adhesive material coating thickness bonding temperature processing time chamber pressure tool pressureAdhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current. Based on the fact that the wafers are not in direct contact, this procedure enables the use of different substrates, e.g. silicon, glass, metals and other semiconductor materials. A drawback is that small structures become wider during patterning which hampers the production of an accurate intermediate layer with tight dimension control. Further, the possibility of corrosion due to out-gassed products, thermal instability and penetration of moisture limits the reliability of the bonding process. Another disadvantage is the missing possibility of hermetically sealed encapsulation due to higher permeability of gas and water molecules while using organic adhesives.".
- Adhesive_bonding wikiPageID "14570219".
- Adhesive_bonding wikiPageLength "19566".
- Adhesive_bonding wikiPageOutDegree "11".
- Adhesive_bonding wikiPageRevisionID "695078026".
- Adhesive_bonding wikiPageWikiLink Benzocyclobutene.
- Adhesive_bonding wikiPageWikiLink Category:Electronics_manufacturing.
- Adhesive_bonding wikiPageWikiLink Category:Packaging_(microfabrication).
- Adhesive_bonding wikiPageWikiLink Category:Semiconductor_technology.
- Adhesive_bonding wikiPageWikiLink Category:Wafer_bonding.
- Adhesive_bonding wikiPageWikiLink Propylene_glycol_methyl_ether_acetate.
- Adhesive_bonding wikiPageWikiLink Wafer_bonding.
- Adhesive_bonding wikiPageWikiLink File:B-ad-bcbprocessflow.png.
- Adhesive_bonding wikiPageWikiLink File:B-ad-crosssectionbcb.png.
- Adhesive_bonding wikiPageWikiLink File:B-ad-schematicsu8bondingprocess.png.
- Adhesive_bonding wikiPageWikiLink File:B-ad-semphotoofsu8.png.
- Adhesive_bonding wikiPageWikiLinkText "Adhesive bonding".
- Adhesive_bonding wikiPageWikiLinkText "Gluing/cementing".
- Adhesive_bonding wikiPageWikiLinkText "Other joining techniques".
- Adhesive_bonding wikiPageWikiLinkText "adhesive bonding".
- Adhesive_bonding wikiPageWikiLinkText "bonded".
- Adhesive_bonding wikiPageWikiLinkText "bonding adhesives".
- Adhesive_bonding wikiPageUsesTemplate Template:Frac.
- Adhesive_bonding wikiPageUsesTemplate Template:Math.
- Adhesive_bonding wikiPageUsesTemplate Template:Wafer_bonding.
- Adhesive_bonding subject Category:Electronics_manufacturing.
- Adhesive_bonding subject Category:Packaging_(microfabrication).
- Adhesive_bonding subject Category:Semiconductor_technology.
- Adhesive_bonding subject Category:Wafer_bonding.
- Adhesive_bonding comment "Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different materials. These produced connections can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces.".
- Adhesive_bonding label "Adhesive bonding".
- Adhesive_bonding sameAs Q4682518.
- Adhesive_bonding sameAs Желимдөө.
- Adhesive_bonding sameAs m.05c5zxx.
- Adhesive_bonding sameAs Q4682518.
- Adhesive_bonding wasDerivedFrom Adhesive_bonding?oldid=695078026.
- Adhesive_bonding isPrimaryTopicOf Adhesive_bonding.