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- 16.766872 author "Changsup Ryu; Kee-Won Kwon; Loke, A.L.S.; Haebum Lee; Nogami, T.; Dubin, V.M.; Kavari, R.A.; Ray, G.W.; Wong, S.S.;".
- 16.766872 bibcode "1999ITED...46.1113R".
- 16.766872 date "June 1999".
- 16.766872 doi "10.1109/16.766872".
- 16.766872 isCitedBy Electromigration.
- 16.766872 issue "6".
- 16.766872 journal "IEEE Transactions on Electron Devices".
- 16.766872 pages "1113–9".
- 16.766872 title "Microstructure and Reliability of Copper Interconnects".
- 16.766872 volume "46".