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- Wafer-level_packaging abstract "Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.There is no single industry-standard method of wafer-level packaging at present.A major application area of WLPs are smartphones due to the size constraints. For example, the Apple iPhone 5 has at least eleven different WLPs, the Samsung Galaxy S3 has six WLPs and the HTC One X has seven. Functions provided WLPs in smartphones include: compass, sensors, power management, wireless etc.In early 2015, it was discovered that a WL-CSP (wafer level chip scale packaging) chip on the Raspberry Pi 2 had issues with xenon flashes (or any other bright long wave flashes of light) inducing photoelectric effect within the integrated circuit. Thus careful consideration of exposure to extremely bright light will need to be considered with wafer level packaging. [1]".
- Wafer-level_packaging wikiPageExternalLink xenon-death-flash-a-free-physics-lesson.
- Wafer-level_packaging wikiPageExternalLink SW2013_John%20Hunt_ASE%20Group.pdf.
- Wafer-level_packaging wikiPageID "23630276".
- Wafer-level_packaging wikiPageLength "2859".
- Wafer-level_packaging wikiPageOutDegree "17".
- Wafer-level_packaging wikiPageRevisionID "678629609".
- Wafer-level_packaging wikiPageWikiLink Category:Chip_carriers.
- Wafer-level_packaging wikiPageWikiLink Category:Electronics_manufacturing.
- Wafer-level_packaging wikiPageWikiLink Category:Semiconductor_technology.
- Wafer-level_packaging wikiPageWikiLink Chip-scale_package.
- Wafer-level_packaging wikiPageWikiLink Chip_scale_package.
- Wafer-level_packaging wikiPageWikiLink HTC_One_X.
- Wafer-level_packaging wikiPageWikiLink IPhone_5.
- Wafer-level_packaging wikiPageWikiLink Integrated_circuit.
- Wafer-level_packaging wikiPageWikiLink List_of_integrated_circuit_packaging_types.
- Wafer-level_packaging wikiPageWikiLink Raspberry_Pi.
- Wafer-level_packaging wikiPageWikiLink Raspberry_Pi_2.
- Wafer-level_packaging wikiPageWikiLink Samsung_Galaxy_S3.
- Wafer-level_packaging wikiPageWikiLink Samsung_Galaxy_S_III.
- Wafer-level_packaging wikiPageWikiLink Smartphone.
- Wafer-level_packaging wikiPageWikiLink Solder.
- Wafer-level_packaging wikiPageWikiLink Wafer-scale_integration.
- Wafer-level_packaging wikiPageWikiLink Wafer_(electronics).
- Wafer-level_packaging wikiPageWikiLink Wafer_bonding.
- Wafer-level_packaging wikiPageWikiLink Wafer_dicing.
- Wafer-level_packaging wikiPageWikiLinkText "Wafer-level packaging".
- Wafer-level_packaging wikiPageWikiLinkText "wafer-level package".
- Wafer-level_packaging wikiPageWikiLinkText "wafer-level packaging".
- Wafer-level_packaging hasPhotoCollection Wafer-level_packaging.
- Wafer-level_packaging wikiPageUsesTemplate Template:Cite_book.
- Wafer-level_packaging wikiPageUsesTemplate Template:Reflist.
- Wafer-level_packaging wikiPageUsesTemplate Template:Semiconductor_packages.
- Wafer-level_packaging subject Category:Chip_carriers.
- Wafer-level_packaging subject Category:Electronics_manufacturing.
- Wafer-level_packaging subject Category:Semiconductor_technology.
- Wafer-level_packaging hypernym Technology.
- Wafer-level_packaging type Company.
- Wafer-level_packaging type Circuit.
- Wafer-level_packaging comment "Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.".
- Wafer-level_packaging label "Wafer-level packaging".
- Wafer-level_packaging sameAs Wafer-level_packaging.
- Wafer-level_packaging sameAs ウエハーレベルCSP.
- Wafer-level_packaging sameAs m.06zs2f3.
- Wafer-level_packaging sameAs Q4017648.
- Wafer-level_packaging sameAs Q4017648.
- Wafer-level_packaging wasDerivedFrom Wafer-level_packaging?oldid=678629609.
- Wafer-level_packaging isPrimaryTopicOf Wafer-level_packaging.