Matches in DBpedia 2016-04 for { <http://wikidata.dbpedia.org/resource/Q5505856> ?p ?o }
Showing triples 1 to 22 of
22
with 100 triples per page.
- Q5505856 subject Q8411638.
- Q5505856 subject Q8728768.
- Q5505856 thumbnail Cmos-chip_structure_in_2000s_(en).svg?width=300.
- Q5505856 wikiPageExternalLink books?id=kxYhNrOKuJQC&pg=PA177&dq=FEOL.
- Q5505856 wikiPageWikiLink Q1069404.
- Q5505856 wikiPageWikiLink Q11456.
- Q5505856 wikiPageWikiLink Q1424524.
- Q5505856 wikiPageWikiLink Q1570432.
- Q5505856 wikiPageWikiLink Q173431.
- Q5505856 wikiPageWikiLink Q176097.
- Q5505856 wikiPageWikiLink Q1798244.
- Q5505856 wikiPageWikiLink Q267131.
- Q5505856 wikiPageWikiLink Q4839229.
- Q5505856 wikiPageWikiLink Q5321.
- Q5505856 wikiPageWikiLink Q5322.
- Q5505856 wikiPageWikiLink Q5339.
- Q5505856 wikiPageWikiLink Q80831.
- Q5505856 wikiPageWikiLink Q8411638.
- Q5505856 wikiPageWikiLink Q8728768.
- Q5505856 comment "The front-end-of-line (FEOL) is the first portion of IC fabrication where the individual devices (transistors, capacitors, resistors, etc.) are patterned in the semiconductor. FEOL generally covers everything up to (but not including) the deposition of metal interconnect layers.FEOL contains all processes of CMOS fabrication needed to form fully isolated CMOS elements: Selecting the type of wafer to be used; Chemical-mechanical planarization and cleaning of the wafer.".
- Q5505856 label "Front end of line".
- Q5505856 depiction Cmos-chip_structure_in_2000s_(en).svg.