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- Q1824523 subject Q8728768.
- Q1824523 subject Q9805826.
- Q1824523 abstract "Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e.g. wafer) using a sacrificial material (e.g. Photoresist).It is an additive technique as opposed to more traditional subtracting technique like etching.The scale of the structures can vary from the nanoscale up to the centimeter scale or further, but are typically of micrometric dimensions.".
- Q1824523 thumbnail Lift-off_(microtechnology)_process.svg?width=300.
- Q1824523 wikiPageExternalLink lift_off.
- Q1824523 wikiPageWikiLink Q1439684.
- Q1824523 wikiPageWikiLink Q146505.
- Q1824523 wikiPageWikiLink Q1484779.
- Q1824523 wikiPageWikiLink Q175821.
- Q1824523 wikiPageWikiLink Q2368605.
- Q1824523 wikiPageWikiLink Q2415817.
- Q1824523 wikiPageWikiLink Q256845.
- Q1824523 wikiPageWikiLink Q267131.
- Q1824523 wikiPageWikiLink Q371965.
- Q1824523 wikiPageWikiLink Q8728768.
- Q1824523 wikiPageWikiLink Q9805826.
- Q1824523 comment "Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e.g. wafer) using a sacrificial material (e.g. Photoresist).It is an additive technique as opposed to more traditional subtracting technique like etching.The scale of the structures can vary from the nanoscale up to the centimeter scale or further, but are typically of micrometric dimensions.".
- Q1824523 label "Lift-off (microtechnology)".
- Q1824523 depiction Lift-off_(microtechnology)_process.svg.