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- Q17007457 subject Q20895941.
- Q17007457 abstract "Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads. The next step after component placement is soldering.There are three categories of components: active, passive and connecting. Active components, such as diodes, transistors, integrated circuits and optoelectronic devices, provide gain or directionality to electrical signals add digital processing and storage. Passive components, such as resistors and capacitors, are used to electronically "tune" a device for optimum performance. Connectors are used to provide electrical communication between electronic devices.".
- Q17007457 wikiPageWikiLink Q1199915.
- Q17007457 wikiPageWikiLink Q1307914.
- Q17007457 wikiPageWikiLink Q1369857.
- Q17007457 wikiPageWikiLink Q1469893.
- Q17007457 wikiPageWikiLink Q173350.
- Q17007457 wikiPageWikiLink Q175821.
- Q17007457 wikiPageWikiLink Q20895941.
- Q17007457 wikiPageWikiLink Q211387.
- Q17007457 wikiPageWikiLink Q455146.
- Q17007457 wikiPageWikiLink Q490060.
- Q17007457 comment "Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads. The next step after component placement is soldering.There are three categories of components: active, passive and connecting.".
- Q17007457 label "Component placement".