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- estc.2006.280194 author "Wiemer, M. and Jia, C. and Töpper, M. and Hauck, K.".
- estc.2006.280194 booktitle "Electronics Systemintegration Technology Conference".
- estc.2006.280194 doi "10.1109/ESTC.2006.280194".
- estc.2006.280194 isCitedBy Adhesive_bonding.
- estc.2006.280194 isbn "1-4244-0552-1".
- estc.2006.280194 journal "1st Electronics Systemintegration Technology Conference, 2006.".
- estc.2006.280194 pages "1401–1405".
- estc.2006.280194 title "Wafer Bonding with BCB and SU-8 for MEMS Packaging".
- estc.2006.280194 volume "1".
- estc.2006.280194 year "2006".