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- dtip.2003.1287047 author "Jung, E. and Ostmann, A. and Wiemer, M. and Kolesnik, I. and Hutter, M.".
- dtip.2003.1287047 booktitle "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003".
- dtip.2003.1287047 doi "10.1109/DTIP.2003.1287047".
- dtip.2003.1287047 isCitedBy Thermocompression_bonding.
- dtip.2003.1287047 pages "255–260".
- dtip.2003.1287047 title "Soldered sealing process to assemble a protective cap for a MEMS CSP".
- dtip.2003.1287047 year "2003".