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- j.microrel.2006.09.034 doi "10.1016/j.microrel.2006.09.034".
- j.microrel.2006.09.034 first1 "Bart".
- j.microrel.2006.09.034 first2 "Mario".
- j.microrel.2006.09.034 first3 "Paresh".
- j.microrel.2006.09.034 first4 "Petar".
- j.microrel.2006.09.034 first5 "Eric".
- j.microrel.2006.09.034 isCitedBy Restriction_of_Hazardous_Substances_Directive.
- j.microrel.2006.09.034 issue "2–3".
- j.microrel.2006.09.034 journal "Microelectronics Reliability".
- j.microrel.2006.09.034 last1 "Vandevelde".
- j.microrel.2006.09.034 last2 "Gonzalez".
- j.microrel.2006.09.034 last3 "Limaye".
- j.microrel.2006.09.034 last4 "Ratchev".
- j.microrel.2006.09.034 last5 "Beyne".
- j.microrel.2006.09.034 pages "259–65".
- j.microrel.2006.09.034 title "Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages".
- j.microrel.2006.09.034 volume "47".
- j.microrel.2006.09.034 year "2007".