Matches in DBpedia 2016-04 for { <http://doi.org/10.1007/978-0-387-76534-1> ?p ?o }
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- 978-0-387-76534-1 author "Farrens, S.".
- 978-0-387-76534-1 booktitle "Wafer Level 3-D ICs Process Technology".
- 978-0-387-76534-1 chapter "4".
- 978-0-387-76534-1 doi "10.1007/978-0-387-76534-1".
- 978-0-387-76534-1 editor "Tan, C. S. and Gutmann, R. J. and Reif, L. R.".
- 978-0-387-76534-1 isCitedBy Adhesive_bonding.
- 978-0-387-76534-1 isCitedBy Eutectic_bonding.
- 978-0-387-76534-1 isCitedBy Thermocompression_bonding.
- 978-0-387-76534-1 pages "49–85".
- 978-0-387-76534-1 publisher "Springer US".
- 978-0-387-76534-1 series "Integrated Circuits and Systems".
- 978-0-387-76534-1 title "Wafer-Bonding Technologies and Strategies for 3D ICs".
- 978-0-387-76534-1 year "2008".