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- Multi-leaded_power_package abstract "The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W.One well-known STMicroelectronics brand of this type of package is Multiwatt.".
- Multi-leaded_power_package thumbnail SIL9_ST_TDA4601.jpg?width=300.
- Multi-leaded_power_package wikiPageID "22282608".
- Multi-leaded_power_package wikiPageLength "3153".
- Multi-leaded_power_package wikiPageOutDegree "16".
- Multi-leaded_power_package wikiPageRevisionID "532055395".
- Multi-leaded_power_package wikiPageWikiLink Audio_power_amplifier.
- Multi-leaded_power_package wikiPageWikiLink Category:Chip_carriers.
- Multi-leaded_power_package wikiPageWikiLink Dual_in-line_package.
- Multi-leaded_power_package wikiPageWikiLink Ground_(electricity).
- Multi-leaded_power_package wikiPageWikiLink Heat_sink.
- Multi-leaded_power_package wikiPageWikiLink Industry_Standard_Architecture.
- Multi-leaded_power_package wikiPageWikiLink Integrated_circuit.
- Multi-leaded_power_package wikiPageWikiLink Mains_electricity.
- Multi-leaded_power_package wikiPageWikiLink Printed_circuit_board.
- Multi-leaded_power_package wikiPageWikiLink STMicroelectronics.
- Multi-leaded_power_package wikiPageWikiLink TO-220.
- Multi-leaded_power_package wikiPageWikiLink TO-3.
- Multi-leaded_power_package wikiPageWikiLink Thermal_conductivity.
- Multi-leaded_power_package wikiPageWikiLink Thermal_grease.
- Multi-leaded_power_package wikiPageWikiLink Thermal_resistance.
- Multi-leaded_power_package wikiPageWikiLink File:SIL9_ST_TDA4601.jpg.
- Multi-leaded_power_package wikiPageWikiLinkText "Multi-leaded power package".
- Multi-leaded_power_package wikiPageWikiLinkText "multi-leaded power package".
- Multi-leaded_power_package subject Category:Chip_carriers.
- Multi-leaded_power_package hypernym Style.
- Multi-leaded_power_package type Circuit.
- Multi-leaded_power_package comment "The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern.".
- Multi-leaded_power_package label "Multi-leaded power package".
- Multi-leaded_power_package sameAs Q6934465.
- Multi-leaded_power_package sameAs m.05q7dc0.
- Multi-leaded_power_package sameAs Q6934465.
- Multi-leaded_power_package wasDerivedFrom Multi-leaded_power_package?oldid=532055395.
- Multi-leaded_power_package depiction SIL9_ST_TDA4601.jpg.
- Multi-leaded_power_package isPrimaryTopicOf Multi-leaded_power_package.