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- Glass_frit_bonding abstract "Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass (\"glass solder\") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair.Glass frit bonding can be used for many surface materials, e.g., silicon with hydrophobic and hydrophilic surface, silicon dioxide, silicon nitride, aluminium, titanium or glass, as long as the CTE are in the same range. This bonding procedure also allows the realization of metallic feedthroughs to contact active structures in the hermetically sealed cavity. Glass frit as a dielectric material does not need additional passivation for preventing leakage currents at process temperatures up to 125 °C.Following advantages resulting in using glass frit bonding procedure: screen printing process applicable on thin, structured wafer no electrical potentials during bonding process necessary low tension due to low bonding temperature selective bonding based on structured intermediate glass layer bonding of rough wafer surfaces no outgassing after bonding, better chemical durability, higher strength compared to organic adhesives high reliability and stable hermetical sealing easier process compared to metallic or eutectic layer procedures↑ ↑ ↑ ↑".
- Glass_frit_bonding wikiPageID "31336130".
- Glass_frit_bonding wikiPageLength "15356".
- Glass_frit_bonding wikiPageOutDegree "63".
- Glass_frit_bonding wikiPageRevisionID "707707271".
- Glass_frit_bonding wikiPageWikiLink Accelerometer.
- Glass_frit_bonding wikiPageWikiLink Adhesive.
- Glass_frit_bonding wikiPageWikiLink Aluminium.
- Glass_frit_bonding wikiPageWikiLink Anodic_bonding.
- Glass_frit_bonding wikiPageWikiLink Barium_silicate.
- Glass_frit_bonding wikiPageWikiLink Binder_(material).
- Glass_frit_bonding wikiPageWikiLink Category:Electronics_manufacturing.
- Glass_frit_bonding wikiPageWikiLink Category:Packaging_(microfabrication).
- Glass_frit_bonding wikiPageWikiLink Category:Semiconductor_technology.
- Glass_frit_bonding wikiPageWikiLink Category:Wafer_bonding.
- Glass_frit_bonding wikiPageWikiLink Cordierite.
- Glass_frit_bonding wikiPageWikiLink Dielectric.
- Glass_frit_bonding wikiPageWikiLink Electronic_packaging.
- Glass_frit_bonding wikiPageWikiLink Eutectic_system.
- Glass_frit_bonding wikiPageWikiLink Feedthrough.
- Glass_frit_bonding wikiPageWikiLink Filler_(materials).
- Glass_frit_bonding wikiPageWikiLink Frit.
- Glass_frit_bonding wikiPageWikiLink Glass.
- Glass_frit_bonding wikiPageWikiLink Glass_transition.
- Glass_frit_bonding wikiPageWikiLink Gyroscope.
- Glass_frit_bonding wikiPageWikiLink Hermetic_seal.
- Glass_frit_bonding wikiPageWikiLink Hydrophile.
- Glass_frit_bonding wikiPageWikiLink Hydrophobe.
- Glass_frit_bonding wikiPageWikiLink Lead.
- Glass_frit_bonding wikiPageWikiLink Lead_glass.
- Glass_frit_bonding wikiPageWikiLink Leakage_(electronics).
- Glass_frit_bonding wikiPageWikiLink Microelectromechanical_systems.
- Glass_frit_bonding wikiPageWikiLink Navier–Stokes_equations.
- Glass_frit_bonding wikiPageWikiLink Optical_window.
- Glass_frit_bonding wikiPageWikiLink Outgassing.
- Glass_frit_bonding wikiPageWikiLink Passivation_(chemistry).
- Glass_frit_bonding wikiPageWikiLink Photolithography.
- Glass_frit_bonding wikiPageWikiLink Plasma_etching.
- Glass_frit_bonding wikiPageWikiLink Porosity.
- Glass_frit_bonding wikiPageWikiLink Pressure_sensor.
- Glass_frit_bonding wikiPageWikiLink Redox.
- Glass_frit_bonding wikiPageWikiLink Reliability_(semiconductor).
- Glass_frit_bonding wikiPageWikiLink Screen_printing.
- Glass_frit_bonding wikiPageWikiLink Silicon.
- Glass_frit_bonding wikiPageWikiLink Silicon_dioxide.
- Glass_frit_bonding wikiPageWikiLink Silicon_nitride.
- Glass_frit_bonding wikiPageWikiLink Sintering.
- Glass_frit_bonding wikiPageWikiLink Solder.
- Glass_frit_bonding wikiPageWikiLink Solvent.
- Glass_frit_bonding wikiPageWikiLink Spin_coating.
- Glass_frit_bonding wikiPageWikiLink Stress_(mechanics).
- Glass_frit_bonding wikiPageWikiLink Thermal_expansion.
- Glass_frit_bonding wikiPageWikiLink Thermal_shock.
- Glass_frit_bonding wikiPageWikiLink Titanium.
- Glass_frit_bonding wikiPageWikiLink Vacuum_deposition.
- Glass_frit_bonding wikiPageWikiLink Viscosity.
- Glass_frit_bonding wikiPageWikiLink Wafer_bonding.
- Glass_frit_bonding wikiPageWikiLink Wetting.
- Glass_frit_bonding wikiPageWikiLinkText "Glass frit bonding".
- Glass_frit_bonding wikiPageWikiLinkText "glass frit bonding".
- Glass_frit_bonding wikiPageWikiLinkText "glass frit".
- Glass_frit_bonding align "left".
- Glass_frit_bonding caption "Bosch".
- Glass_frit_bonding caption "Fraunhofer IZM".
- Glass_frit_bonding direction "horizontal".
- Glass_frit_bonding header "Microscopic cross sectional SEM images of glass frit bonded silicon wafers.".
- Glass_frit_bonding image "b-gf-crosssectionsembosch.png".
- Glass_frit_bonding image "b-gf-crosssectionsemizm.png".
- Glass_frit_bonding width "300".
- Glass_frit_bonding wikiPageUsesTemplate Template:Clear.
- Glass_frit_bonding wikiPageUsesTemplate Template:Multiple_images.
- Glass_frit_bonding wikiPageUsesTemplate Template:Reflist.
- Glass_frit_bonding wikiPageUsesTemplate Template:Wafer_bonding.
- Glass_frit_bonding subject Category:Electronics_manufacturing.
- Glass_frit_bonding subject Category:Packaging_(microfabrication).
- Glass_frit_bonding subject Category:Semiconductor_technology.
- Glass_frit_bonding subject Category:Wafer_bonding.
- Glass_frit_bonding comment "Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass (\"glass solder\") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature.".
- Glass_frit_bonding label "Glass frit bonding".
- Glass_frit_bonding sameAs Q5567109.
- Glass_frit_bonding sameAs m.0gkzy_r.
- Glass_frit_bonding sameAs Q5567109.
- Glass_frit_bonding wasDerivedFrom Glass_frit_bonding?oldid=707707271.
- Glass_frit_bonding isPrimaryTopicOf Glass_frit_bonding.