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- Bead_probe_technology abstract "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.".
- Bead_probe_technology thumbnail BEAD_PROBE.JPG?width=300.
- Bead_probe_technology wikiPageID "13642299".
- Bead_probe_technology wikiPageLength "6347".
- Bead_probe_technology wikiPageOutDegree "26".
- Bead_probe_technology wikiPageRevisionID "682085468".
- Bead_probe_technology wikiPageWikiLink Ball_grid_array.
- Bead_probe_technology wikiPageWikiLink Boundary_scan.
- Bead_probe_technology wikiPageWikiLink Category:Hardware_testing.
- Bead_probe_technology wikiPageWikiLink Category:Printed_circuit_board_manufacturing.
- Bead_probe_technology wikiPageWikiLink Conductive_elastomer.
- Bead_probe_technology wikiPageWikiLink Device_under_test.
- Bead_probe_technology wikiPageWikiLink File:BEAD_PROBE.JPG.
- Bead_probe_technology wikiPageWikiLink File:Typical_Bead_Probe_01.JPG.
- Bead_probe_technology wikiPageWikiLink Flux_(metallurgy).
- Bead_probe_technology wikiPageWikiLink Hot_air_solder_leveling.
- Bead_probe_technology wikiPageWikiLink In-circuit_test.
- Bead_probe_technology wikiPageWikiLink Integrated_circuit.
- Bead_probe_technology wikiPageWikiLink Printed_circuit_board.
- Bead_probe_technology wikiPageWikiLink Reflow_soldering.
- Bead_probe_technology wikiPageWikiLink Serial_communication.
- Bead_probe_technology wikiPageWikiLink Solder.
- Bead_probe_technology wikiPageWikiLink Solder_mask.
- Bead_probe_technology wikiPageWikiLink Solder_paste.
- Bead_probe_technology wikiPageWikiLink Surface-mount_technology.
- Bead_probe_technology wikiPageWikiLink Test_probe.
- Bead_probe_technology wikiPageWikiLink Thousandth_of_an_inch.
- Bead_probe_technology wikiPageWikiLink Via_(electronics).
- Bead_probe_technology wikiPageWikiLink Wiktionary:obround.
- Bead_probe_technology wikiPageWikiLink File:Waygood.jpg.
- Bead_probe_technology wikiPageWikiLinkText "Bead probe technology".
- Bead_probe_technology wikiPageUsesTemplate Template:Reflist.
- Bead_probe_technology subject Category:Hardware_testing.
- Bead_probe_technology subject Category:Printed_circuit_board_manufacturing.
- Bead_probe_technology hypernym Technique.
- Bead_probe_technology type TopicalConcept.
- Bead_probe_technology comment "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.".
- Bead_probe_technology label "Bead probe technology".
- Bead_probe_technology sameAs Q4876056.
- Bead_probe_technology sameAs m.03ccst4.
- Bead_probe_technology sameAs Q4876056.
- Bead_probe_technology wasDerivedFrom Bead_probe_technology?oldid=682085468.
- Bead_probe_technology depiction BEAD_PROBE.JPG.
- Bead_probe_technology isPrimaryTopicOf Bead_probe_technology.