DBpedia – Linked Data Fragments

Matches in DBpedia 2016-04 for { ?s ?p "Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass (\"glass solder\") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair.Glass frit bonding can be used for many surface materials, e.g., silicon with hydrophobic and hydrophilic surface, silicon dioxide, silicon nitride, aluminium, titanium or glass, as long as the CTE are in the same range. This bonding procedure also allows the realization of metallic feedthroughs to contact active structures in the hermetically sealed cavity. Glass frit as a dielectric material does not need additional passivation for preventing leakage currents at process temperatures up to 125 °C.Following advantages resulting in using glass frit bonding procedure: screen printing process applicable on thin, structured wafer no electrical potentials during bonding process necessary low tension due to low bonding temperature selective bonding based on structured intermediate glass layer bonding of rough wafer surfaces no outgassing after bonding, better chemical durability, higher strength compared to organic adhesives high reliability and stable hermetical sealing easier process compared to metallic or eutectic layer procedures↑ ↑ ↑ ↑"@en }

• Glass_frit_bonding abstract "Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass (\"glass solder\") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair.Glass frit bonding can be used for many surface materials, e.g., silicon with hydrophobic and hydrophilic surface, silicon dioxide, silicon nitride, aluminium, titanium or glass, as long as the CTE are in the same range. This bonding procedure also allows the realization of metallic feedthroughs to contact active structures in the hermetically sealed cavity. Glass frit as a dielectric material does not need additional passivation for preventing leakage currents at process temperatures up to 125 °C.Following advantages resulting in using glass frit bonding procedure: screen printing process applicable on thin, structured wafer no electrical potentials during bonding process necessary low tension due to low bonding temperature selective bonding based on structured intermediate glass layer bonding of rough wafer surfaces no outgassing after bonding, better chemical durability, higher strength compared to organic adhesives high reliability and stable hermetical sealing easier process compared to metallic or eutectic layer procedures↑ ↑ ↑ ↑".