Matches in DBpedia 2016-04 for { ?s ?p "Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass (\"glass solder\") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature."@en }
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- Glass_frit_bonding comment "Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass (\"glass solder\") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature.".