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- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 accessdate "2014-05-15".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 date "2010-07-06".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 first "Lee".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 isCitedBy Three-dimensional_integrated_circuit.
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 issue "Issue 34".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 last "Smith".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 publisher "Amkor Technology".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 title "Achieving the 3rd Generation From 3D Packaging to 3D IC Architectures".
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 url index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250.
- index.cfm?objectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250 work "Future Fab International".