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- Wafer_bonding abstract "Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices.".
- Wafer_bonding wikiPageID "31331135".
- Wafer_bonding wikiPageLength "4346".
- Wafer_bonding wikiPageOutDegree "19".
- Wafer_bonding wikiPageRevisionID "658958281".
- Wafer_bonding wikiPageWikiLink Adhesive_bonding.
- Wafer_bonding wikiPageWikiLink Anodic_bonding.
- Wafer_bonding wikiPageWikiLink Bond_characterization.
- Wafer_bonding wikiPageWikiLink Category:Chemical_bonding.
- Wafer_bonding wikiPageWikiLink Category:Electronics_manufacturing.
- Wafer_bonding wikiPageWikiLink Category:Packaging_(microfabrication).
- Wafer_bonding wikiPageWikiLink Category:Semiconductor_technology.
- Wafer_bonding wikiPageWikiLink Category:Wafer_bonding.
- Wafer_bonding wikiPageWikiLink Direct_bonding.
- Wafer_bonding wikiPageWikiLink Eutectic_bonding.
- Wafer_bonding wikiPageWikiLink Glass_frit_bonding.
- Wafer_bonding wikiPageWikiLink Microelectromechanical_systems.
- Wafer_bonding wikiPageWikiLink Nanoelectromechanical_systems.
- Wafer_bonding wikiPageWikiLink Plasma-activated_bonding.
- Wafer_bonding wikiPageWikiLink Plasma_activated_bonding.
- Wafer_bonding wikiPageWikiLink Reactive_bonding.
- Wafer_bonding wikiPageWikiLink Thermocompression_bonding.
- Wafer_bonding wikiPageWikiLink Transient_liquid_phase_diffusion_bonding.
- Wafer_bonding wikiPageWikiLink Wafer_(electronics).
- Wafer_bonding wikiPageWikiLinkText "Wafer bonding".
- Wafer_bonding wikiPageWikiLinkText "bonded wafer".
- Wafer_bonding wikiPageWikiLinkText "wafer bonding".
- Wafer_bonding hasPhotoCollection Wafer_bonding.
- Wafer_bonding wikiPageUsesTemplate Template:Wafer_bonding.
- Wafer_bonding subject Category:Chemical_bonding.
- Wafer_bonding subject Category:Electronics_manufacturing.
- Wafer_bonding subject Category:Packaging_(microfabrication).
- Wafer_bonding subject Category:Semiconductor_technology.
- Wafer_bonding subject Category:Wafer_bonding.
- Wafer_bonding hypernym Technology.
- Wafer_bonding type Company.
- Wafer_bonding comment "Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices.".
- Wafer_bonding label "Wafer bonding".
- Wafer_bonding sameAs Waferbonden.
- Wafer_bonding sameAs Collegamento_su_wafer.
- Wafer_bonding sameAs m.0gjddvp.
- Wafer_bonding sameAs Q677010.
- Wafer_bonding sameAs Q677010.
- Wafer_bonding wasDerivedFrom Wafer_bonding?oldid=658958281.
- Wafer_bonding isPrimaryTopicOf Wafer_bonding.