DBpedia 2015-10

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Thin_Small_Outline_Package abstract "Thin Small Outline Package, or TSOP is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, Flash memory, FSRAM and E2PROM find this package symbiotic with end-use products. It answers the needs required by telecom, cellular, memory modules, PC Cards (PCMCIA cards), wireless, netbooks and countless other product applications.TSOP is the smallest leaded form factor for flash memory.".
Thin_Small_Outline_Package thumbnail TSOP_32_(T1)_BW.svg?width=300.
Thin_Small_Outline_Package wikiPageExternalLink Category:IC_packages.
Thin_Small_Outline_Package wikiPageExternalLink tsop.
Thin_Small_Outline_Package wikiPageID "1872794".
Thin_Small_Outline_Package wikiPageLength "2881".
Thin_Small_Outline_Package wikiPageOutDegree "16".
Thin_Small_Outline_Package wikiPageRevisionID "586698247".
Thin_Small_Outline_Package wikiPageWikiLink Ball_grid_array.
Thin_Small_Outline_Package wikiPageWikiLink Category:Chip_carriers.
Thin_Small_Outline_Package wikiPageWikiLink Chip_carrier.
Thin_Small_Outline_Package wikiPageWikiLink E2PROM.
Thin_Small_Outline_Package wikiPageWikiLink EEPROM.
Thin_Small_Outline_Package wikiPageWikiLink FSRAM.
Thin_Small_Outline_Package wikiPageWikiLink Flash_memory.
Thin_Small_Outline_Package wikiPageWikiLink Integrated_circuit.
Thin_Small_Outline_Package wikiPageWikiLink PC_Card.
Thin_Small_Outline_Package wikiPageWikiLink Plastic_small-outline_package.
Thin_Small_Outline_Package wikiPageWikiLink Shrink_small-outline_package.
Thin_Small_Outline_Package wikiPageWikiLink Small-outline_integrated_circuit.
Thin_Small_Outline_Package wikiPageWikiLink Small_Outline_Integrated_Circuit.
Thin_Small_Outline_Package wikiPageWikiLink Static_random-access_memory.
Thin_Small_Outline_Package wikiPageWikiLink Static_random_access_memory.
Thin_Small_Outline_Package wikiPageWikiLink Surface-mount_technology.
Thin_Small_Outline_Package wikiPageWikiLink Surface_mount.
Thin_Small_Outline_Package wikiPageWikiLink TSSOP.
Thin_Small_Outline_Package wikiPageWikiLink File:TSOP_32_(T1)_BW.svg.
Thin_Small_Outline_Package wikiPageWikiLinkText "Thin Small Outline Package".
Thin_Small_Outline_Package hasPhotoCollection Thin_Small_Outline_Package.
Thin_Small_Outline_Package wikiPageUsesTemplate Template:Refimprove.
Thin_Small_Outline_Package wikiPageUsesTemplate Template:Reflist.
Thin_Small_Outline_Package wikiPageUsesTemplate Template:Semiconductor_packages.
Thin_Small_Outline_Package subject Category:Chip_carriers.
Thin_Small_Outline_Package hypernym Surface.
Thin_Small_Outline_Package type Bone.
Thin_Small_Outline_Package comment "Thin Small Outline Package, or TSOP is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory.".
Thin_Small_Outline_Package label "Thin Small Outline Package".
Thin_Small_Outline_Package sameAs TSOP.
Thin_Small_Outline_Package sameAs Thin_Small_Outline_Package.
Thin_Small_Outline_Package sameAs Thin_Small-Outline_Package.
Thin_Small_Outline_Package sameAs m.02p51dh.
Thin_Small_Outline_Package sameAs TSOP.
Thin_Small_Outline_Package sameAs Q1336851.
Thin_Small_Outline_Package sameAs Q1336851.
Thin_Small_Outline_Package wasDerivedFrom Thin_Small_Outline_Package?oldid=586698247.
Thin_Small_Outline_Package depiction TSOP_32_(T1)_BW.svg.
Thin_Small_Outline_Package isPrimaryTopicOf Thin_Small_Outline_Package.