Matches in DBpedia 2015-10 for { <http://dbpedia.org/resource/Package_on_package> ?p ?o }
Showing triples 1 to 66 of
66
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- Package_on_package abstract "Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.".
- Package_on_package thumbnail ASIC_+_Memory_PoP_Schematic.JPG?width=300.
- Package_on_package wikiPageExternalLink beagleboard.org.
- Package_on_package wikiPageExternalLink 10161-defects-database.
- Package_on_package wikiPageExternalLink 10284-defectsdatabase.
- Package_on_package wikiPageExternalLink 10618-defects-database.
- Package_on_package wikiPageExternalLink proceedings_abstract.cfm?PROC_ID=2649.
- Package_on_package wikiPageExternalLink BNP_GUID_9-5-2006_A_10000000000000433369.
- Package_on_package wikiPageExternalLink showArticle.jhtml?articleID=211201709.
- Package_on_package wikiPageExternalLink showArticle.jhtml?articleID=209900383&cid=RSSfeed_eetimes_semiRSS.
- Package_on_package wikiPageExternalLink www.packageonpackagebook.com.
- Package_on_package wikiPageExternalLink amkor-pop.htm.
- Package_on_package wikiPageExternalLink CA6445430.html.
- Package_on_package wikiPageExternalLink CA6611115.html?desc=topstory.
- Package_on_package wikiPageExternalLink Semiconductor_Intl_PoP_April_2010.ashxInnovations.
- Package_on_package wikiPageExternalLink STATSChipPAC_ECTC2010_s40p01.ashx.
- Package_on_package wikiPageExternalLink POP.ashx.
- Package_on_package wikiPageID "12792117".
- Package_on_package wikiPageLength "8122".
- Package_on_package wikiPageOutDegree "18".
- Package_on_package wikiPageRevisionID "673832469".
- Package_on_package wikiPageWikiLink 3D_Die-Stacking.
- Package_on_package wikiPageWikiLink Ball_grid_array.
- Package_on_package wikiPageWikiLink Category:Chip_carriers.
- Package_on_package wikiPageWikiLink Category:Packaging_(microfabrication).
- Package_on_package wikiPageWikiLink Category:Semiconductor_device_fabrication.
- Package_on_package wikiPageWikiLink Digital_camera.
- Package_on_package wikiPageWikiLink Integrated_circuit_packaging.
- Package_on_package wikiPageWikiLink JEDEC.
- Package_on_package wikiPageWikiLink Mobile_phone.
- Package_on_package wikiPageWikiLink PCB_Assembly.
- Package_on_package wikiPageWikiLink Personal_digital_assistant.
- Package_on_package wikiPageWikiLink Printed_circuit_board.
- Package_on_package wikiPageWikiLink Reflow_soldering.
- Package_on_package wikiPageWikiLink System_in_package.
- Package_on_package wikiPageWikiLink System_on_a_chip.
- Package_on_package wikiPageWikiLink Three-dimensional_integrated_circuit.
- Package_on_package wikiPageWikiLink File:ASIC_+_Memory_PoP_Schematic.JPG.
- Package_on_package wikiPageWikiLinkText "POP".
- Package_on_package wikiPageWikiLinkText "Package on package".
- Package_on_package wikiPageWikiLinkText "PoP packaging".
- Package_on_package wikiPageWikiLinkText "PoP".
- Package_on_package wikiPageWikiLinkText "package on package".
- Package_on_package wikiPageWikiLinkText "package-on-package".
- Package_on_package wikiPageWikiLinkText "stacked".
- Package_on_package hasPhotoCollection Package_on_package.
- Package_on_package wikiPageUsesTemplate Template:Reflist.
- Package_on_package wikiPageUsesTemplate Template:Semiconductor_packages.
- Package_on_package subject Category:Chip_carriers.
- Package_on_package subject Category:Packaging_(microfabrication).
- Package_on_package subject Category:Semiconductor_device_fabrication.
- Package_on_package hypernym Method.
- Package_on_package type Software.
- Package_on_package type Circuit.
- Package_on_package type Process.
- Package_on_package type Semiconductor.
- Package_on_package comment "Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.".
- Package_on_package label "Package on package".
- Package_on_package sameAs Package-on-Package.
- Package_on_package sameAs Package_on_Package.
- Package_on_package sameAs m.02x53fv.
- Package_on_package sameAs Q130652.
- Package_on_package sameAs Q130652.
- Package_on_package wasDerivedFrom Package_on_package?oldid=673832469.
- Package_on_package depiction ASIC_+_Memory_PoP_Schematic.JPG.
- Package_on_package isPrimaryTopicOf Package_on_package.