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- Low_pressure_molding abstract "Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens to keep the desired form upon cooling down. These polyamide materials differ from other thermoplastics in two main areas:One: Viscosity: At processing temperature (410F/210C) the viscosity is very low, typically around 3,000 centipoise (similar to pancake syrup). Low viscosity materials require low injection pressure in order to inject into a cavity. In fact it is normal to use a simple gear pump to inject the polyamide material. Low injection pressure is paramount, when over-molding relatively fragile electronic component.Two: Adhesion: Polyamide materials are basically high performance hot-melt adhesives. The adhesive properties of polyamide is what seals a chosen substrate. The type of adhesion is purely mechanical i.e. no chemical reaction takes place.".
- Low_pressure_molding wikiPageID "31689204".
- Low_pressure_molding wikiPageLength "4389".
- Low_pressure_molding wikiPageOutDegree "15".
- Low_pressure_molding wikiPageRevisionID "627037852".
- Low_pressure_molding wikiPageWikiLink Adhesive.
- Low_pressure_molding wikiPageWikiLink Category:Electronics_manufacturing.
- Low_pressure_molding wikiPageWikiLink Centipoise.
- Low_pressure_molding wikiPageWikiLink Circuit_boards.
- Low_pressure_molding wikiPageWikiLink Henkel_Corporation.
- Low_pressure_molding wikiPageWikiLink Hot-melt.
- Low_pressure_molding wikiPageWikiLink Hot-melt_adhesive.
- Low_pressure_molding wikiPageWikiLink Hygrometer.
- Low_pressure_molding wikiPageWikiLink Moisture_sensor.
- Low_pressure_molding wikiPageWikiLink Motor_control.
- Low_pressure_molding wikiPageWikiLink Poise.
- Low_pressure_molding wikiPageWikiLink Polyamide.
- Low_pressure_molding wikiPageWikiLink Polyolefin.
- Low_pressure_molding wikiPageWikiLink Potting_(electronics).
- Low_pressure_molding wikiPageWikiLink Printed_circuit_board.
- Low_pressure_molding wikiPageWikiLink RF_ID_tag.
- Low_pressure_molding wikiPageWikiLink Radio-frequency_identification.
- Low_pressure_molding wikiPageWikiLink Thermoplastic.
- Low_pressure_molding wikiPageWikiLink USB_flash_drive.
- Low_pressure_molding wikiPageWikiLink USB_thumb_drive.
- Low_pressure_molding wikiPageWikiLink Viscosity.
- Low_pressure_molding date "December 2013".
- Low_pressure_molding hasPhotoCollection Low_pressure_molding.
- Low_pressure_molding reason "1970.0".
- Low_pressure_molding wikiPageUsesTemplate Template:Failed_verification.
- Low_pressure_molding wikiPageUsesTemplate Template:Ref_improve.
- Low_pressure_molding wikiPageUsesTemplate Template:Reflist.
- Low_pressure_molding subject Category:Electronics_manufacturing.
- Low_pressure_molding hypernym Process.
- Low_pressure_molding type Election.
- Low_pressure_molding comment "Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.Key to this process are the raw materials and specialized molding equipment.".
- Low_pressure_molding label "Low pressure molding".
- Low_pressure_molding sameAs m.0gtt0tk.
- Low_pressure_molding sameAs Q6693038.
- Low_pressure_molding sameAs Q6693038.
- Low_pressure_molding wasDerivedFrom Low_pressure_molding?oldid=627037852.
- Low_pressure_molding isPrimaryTopicOf Low_pressure_molding.