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- Hybrid_Memory_Cube abstract "Hybrid Memory Cube (HMC) is a high-performance RAM interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).Hybrid Memory Cube was announced by Micron Technology in 2011 and promises a 15 times speed improvement over DDR3. The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including Samsung, Micron Technology, Open-Silicon, ARM, HP, Microsoft, Altera, and Xilinx.HMC combines through-silicon vias (TSV) and microbumps to connect multiple (currently 4 to 8) dies of memory cell arrays on top of each other. The memory controller is integrated as a separate die.HMC uses standard DRAM cells but it has more data banks than classic DRAM memory of the same size. The HMC interface is of course incompatible with current DDRn (DDR2 or DDR3) implementations.HMC technology won the Best New Technology award from The Linley Group (publisher of Microprocessor Report magazine) in 2011.The first public specification, HMC 1.0, was published in April 2013. According to it, the HMC uses 16-lane or 8-lane (half size) full-duplex differential serial links, with each lane having 10, 12.5 or 15 Gbit/s SerDes. Each HMC package is named a cube, and they can be chained in a network of up to 8 cubes with cube-to-cube links and some cubes using their links as pass-through links. A typical cube package with 4 links has 896 BGA pins and a size of 31x31x3.8 millimeters.The typical raw bandwidth of a single 16-lane link with 10 Gbit/s signalling implies a total bandwidth of all 16 lanes of 40 GB/s (20 GB/s transmit and 20 GB/s receive); cubes with 4 and 8 links are planned. Effective memory bandwidth utilization varies from 33% to 50% for smallest packets of 32 bytes; and from 45% to 85% for 128 byte packets.As reported at the HotChips 23 conference in 2011, the first generation of HMC demonstration cubes with four 50 nm DRAM memory dies and one 90 nm logic die with total capacity of 512 MB and size 27x27 mm had power consumption of 11 W and was powered with 1.2 V.Engineering samples of second generation HMC memory chips were shipped in September 2013 by Micron. Samples of 2 GB HMC (stack of 4 memory dies, each of 4 Gbit) are packed in a 31×31 mm package and have 4 HMC links. Other samples from 2013 have only two HMC links and a smaller package: 16×19.5 mm.The second version of the HMC specification was published on 18 November 2014 by HMCCSystems incorporating HMC are expected to ship in 2015.JEDEC's Wide I/O and Wide I/O 2 are seen as the mobile computing counterparts to the desktop/server-oriented HMC in that both involve 3D die stacks.".
- Hybrid_Memory_Cube wikiPageExternalLink 20130402_HPCwire_%20Stacking%20Stairs%20Against%20the%20Memory%20Wall.pdf.
- Hybrid_Memory_Cube wikiPageExternalLink HMC_Specification%201_0.pdf.
- Hybrid_Memory_Cube wikiPageExternalLink HC23.18.320-HybridCube-Pawlowski-Micron.pdf.
- Hybrid_Memory_Cube wikiPageExternalLink specification-v2-download-form.
- Hybrid_Memory_Cube wikiPageID "38898926".
- Hybrid_Memory_Cube wikiPageLength "7914".
- Hybrid_Memory_Cube wikiPageOutDegree "38".
- Hybrid_Memory_Cube wikiPageRevisionID "683555988".
- Hybrid_Memory_Cube wikiPageWikiLink 3D_XPoint.
- Hybrid_Memory_Cube wikiPageWikiLink AMD.
- Hybrid_Memory_Cube wikiPageWikiLink ARM_Holdings.
- Hybrid_Memory_Cube wikiPageWikiLink Advanced_Micro_Devices.
- Hybrid_Memory_Cube wikiPageWikiLink Altera.
- Hybrid_Memory_Cube wikiPageWikiLink Bandwidth_(computing).
- Hybrid_Memory_Cube wikiPageWikiLink Category:Computer_memory.
- Hybrid_Memory_Cube wikiPageWikiLink Category:Types_of_RAM.
- Hybrid_Memory_Cube wikiPageWikiLink DDR2_SDRAM.
- Hybrid_Memory_Cube wikiPageWikiLink DDR3.
- Hybrid_Memory_Cube wikiPageWikiLink DDR3_SDRAM.
- Hybrid_Memory_Cube wikiPageWikiLink DRAM.
- Hybrid_Memory_Cube wikiPageWikiLink Die_(integrated_circuit).
- Hybrid_Memory_Cube wikiPageWikiLink Dynamic_random-access_memory.
- Hybrid_Memory_Cube wikiPageWikiLink Gbit.
- Hybrid_Memory_Cube wikiPageWikiLink GeForce_1000_Series.
- Hybrid_Memory_Cube wikiPageWikiLink GeForce_1000_series.
- Hybrid_Memory_Cube wikiPageWikiLink Gigabit.
- Hybrid_Memory_Cube wikiPageWikiLink Gigabyte.
- Hybrid_Memory_Cube wikiPageWikiLink HP.
- Hybrid_Memory_Cube wikiPageWikiLink Hewlett-Packard.
- Hybrid_Memory_Cube wikiPageWikiLink High_Bandwidth_Memory.
- Hybrid_Memory_Cube wikiPageWikiLink Hynix.
- Hybrid_Memory_Cube wikiPageWikiLink JEDEC.
- Hybrid_Memory_Cube wikiPageWikiLink Megabyte.
- Hybrid_Memory_Cube wikiPageWikiLink Microbump.
- Hybrid_Memory_Cube wikiPageWikiLink Micron_Technology.
- Hybrid_Memory_Cube wikiPageWikiLink Microsoft.
- Hybrid_Memory_Cube wikiPageWikiLink Multi-chip_module.
- Hybrid_Memory_Cube wikiPageWikiLink Nvidia.
- Hybrid_Memory_Cube wikiPageWikiLink Open-Silicon.
- Hybrid_Memory_Cube wikiPageWikiLink Random-access_memory.
- Hybrid_Memory_Cube wikiPageWikiLink SK_Hynix.
- Hybrid_Memory_Cube wikiPageWikiLink Samsung.
- Hybrid_Memory_Cube wikiPageWikiLink SerDes.
- Hybrid_Memory_Cube wikiPageWikiLink The_Linley_Group.
- Hybrid_Memory_Cube wikiPageWikiLink Through-silicon_via.
- Hybrid_Memory_Cube wikiPageWikiLink O.
- Hybrid_Memory_Cube wikiPageWikiLink O_2.
- Hybrid_Memory_Cube wikiPageWikiLink Xilinx.
- Hybrid_Memory_Cube wikiPageWikiLinkText "Hybrid Memory Cube".
- Hybrid_Memory_Cube hasPhotoCollection Hybrid_Memory_Cube.
- Hybrid_Memory_Cube wikiPageUsesTemplate Template:Memory_types.
- Hybrid_Memory_Cube wikiPageUsesTemplate Template:Official_website.
- Hybrid_Memory_Cube wikiPageUsesTemplate Template:Reflist.
- Hybrid_Memory_Cube wikiPageUsesTemplate Template:Use_dmy_dates.
- Hybrid_Memory_Cube wikiPageUsesTemplate Template:Youtube.
- Hybrid_Memory_Cube subject Category:Computer_memory.
- Hybrid_Memory_Cube subject Category:Types_of_RAM.
- Hybrid_Memory_Cube hypernym Interface.
- Hybrid_Memory_Cube type Software.
- Hybrid_Memory_Cube type Array.
- Hybrid_Memory_Cube type Datum.
- Hybrid_Memory_Cube comment "Hybrid Memory Cube (HMC) is a high-performance RAM interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).Hybrid Memory Cube was announced by Micron Technology in 2011 and promises a 15 times speed improvement over DDR3.".
- Hybrid_Memory_Cube label "Hybrid Memory Cube".
- Hybrid_Memory_Cube sameAs Hybrid_Memory_Cube.
- Hybrid_Memory_Cube sameAs Hybrid_Memory_Cube.
- Hybrid_Memory_Cube sameAs m.0ryttrr.
- Hybrid_Memory_Cube sameAs Hybrid_Memory_Cube.
- Hybrid_Memory_Cube sameAs Q3143645.
- Hybrid_Memory_Cube sameAs Q3143645.
- Hybrid_Memory_Cube wasDerivedFrom Hybrid_Memory_Cube?oldid=683555988.
- Hybrid_Memory_Cube homepage www.hybridmemorycube.org.
- Hybrid_Memory_Cube isPrimaryTopicOf Hybrid_Memory_Cube.