Matches in DBpedia 2015-10 for { <http://dbpedia.org/resource/Flip_chip> ?p ?o }
Showing triples 1 to 77 of
77
with 100 triples per page.
- Flip_chip abstract "Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.".
- Flip_chip wikiPageExternalLink 31627038.html.
- Flip_chip wikiPageID "383131".
- Flip_chip wikiPageLength "8016".
- Flip_chip wikiPageOutDegree "36".
- Flip_chip wikiPageRevisionID "673885064".
- Flip_chip wikiPageWikiLink Adhesive.
- Flip_chip wikiPageWikiLink Category:Chip_carriers.
- Flip_chip wikiPageWikiLink Circuit_board.
- Flip_chip wikiPageWikiLink Conductive_polymer.
- Flip_chip wikiPageWikiLink DEC_Alpha.
- Flip_chip wikiPageWikiLink Delco_Electronics.
- Flip_chip wikiPageWikiLink Digital_Equipment_Corporation.
- Flip_chip wikiPageWikiLink Gold.
- Flip_chip wikiPageWikiLink Hot_air_reflow.
- Flip_chip wikiPageWikiLink IBM.
- Flip_chip wikiPageWikiLink IBM_3081.
- Flip_chip wikiPageWikiLink IBM_Solid_Logic_Technology.
- Flip_chip wikiPageWikiLink Inductance.
- Flip_chip wikiPageWikiLink Insulator_(electrical).
- Flip_chip wikiPageWikiLink Insulator_(electricity).
- Flip_chip wikiPageWikiLink Integrated_circuit.
- Flip_chip wikiPageWikiLink Mainframe_computer.
- Flip_chip wikiPageWikiLink Microelectromechanical_systems.
- Flip_chip wikiPageWikiLink Mobile_phone.
- Flip_chip wikiPageWikiLink Pager.
- Flip_chip wikiPageWikiLink Printed_circuit_assembly.
- Flip_chip wikiPageWikiLink Printed_circuit_board.
- Flip_chip wikiPageWikiLink Reflow_solder.
- Flip_chip wikiPageWikiLink Reflow_soldering.
- Flip_chip wikiPageWikiLink Semiconductor_device.
- Flip_chip wikiPageWikiLink Semiconductor_device_fabrication.
- Flip_chip wikiPageWikiLink Semiconductor_fabrication.
- Flip_chip wikiPageWikiLink Siemens.
- Flip_chip wikiPageWikiLink Siemens_AG.
- Flip_chip wikiPageWikiLink Solder.
- Flip_chip wikiPageWikiLink Solid_Logic_Technology.
- Flip_chip wikiPageWikiLink Thermal_bridge.
- Flip_chip wikiPageWikiLink Thermal_expansion.
- Flip_chip wikiPageWikiLink Thermosonic_Bonding.
- Flip_chip wikiPageWikiLink Thermosonic_bonding.
- Flip_chip wikiPageWikiLink Wafer_(electronics).
- Flip_chip wikiPageWikiLink Wire_bonding.
- Flip_chip wikiPageWikiLink File:Flip_chip_side-view.svg.
- Flip_chip wikiPageWikiLink File:R107FlipChipTop.JPG.
- Flip_chip wikiPageWikiLink File:Wirebonding.svg.
- Flip_chip wikiPageWikiLinkText "C4".
- Flip_chip wikiPageWikiLinkText "FC".
- Flip_chip wikiPageWikiLinkText "Flip chip".
- Flip_chip wikiPageWikiLinkText "Flip-chip".
- Flip_chip wikiPageWikiLinkText "flip chip".
- Flip_chip wikiPageWikiLinkText "flip-chip".
- Flip_chip wikiPageWikiLinkText "solder bumps".
- Flip_chip hasPhotoCollection Flip_chip.
- Flip_chip wikiPageUsesTemplate Template:About.
- Flip_chip wikiPageUsesTemplate Template:Citation_needed.
- Flip_chip wikiPageUsesTemplate Template:Reflist.
- Flip_chip wikiPageUsesTemplate Template:Semiconductor_packages.
- Flip_chip subject Category:Chip_carriers.
- Flip_chip hypernym Method.
- Flip_chip type Article.
- Flip_chip type Software.
- Flip_chip type Article.
- Flip_chip type Circuit.
- Flip_chip comment "Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step.".
- Flip_chip label "Flip chip".
- Flip_chip sameAs Flip_xip.
- Flip_chip sameAs Flip-Chip-Montage.
- Flip_chip sameAs Flip_chip.
- Flip_chip sameAs Puce_retournée.
- Flip_chip sameAs m.025swhm.
- Flip_chip sameAs Flip_chip.
- Flip_chip sameAs Q432439.
- Flip_chip sameAs Q432439.
- Flip_chip sameAs 覆晶技術.
- Flip_chip wasDerivedFrom Flip_chip?oldid=673885064.
- Flip_chip isPrimaryTopicOf Flip_chip.
