Matches in DBpedia 2015-10 for { <http://dbpedia.org/resource/Die_preparation> ?p ?o }
Showing triples 1 to 49 of
49
with 100 triples per page.
- Die_preparation abstract "Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.".
- Die_preparation thumbnail Mounted_wafer.jpg?width=300.
- Die_preparation wikiPageID "1048685".
- Die_preparation wikiPageLength "2728".
- Die_preparation wikiPageOutDegree "16".
- Die_preparation wikiPageRevisionID "663094538".
- Die_preparation wikiPageWikiLink Category:Semiconductor_device_fabrication.
- Die_preparation wikiPageWikiLink Diamond_tool.
- Die_preparation wikiPageWikiLink Diamond_tools.
- Die_preparation wikiPageWikiLink Die_(integrated_circuit).
- Die_preparation wikiPageWikiLink Fabrication_(semiconductor).
- Die_preparation wikiPageWikiLink IC_packaging.
- Die_preparation wikiPageWikiLink IC_testing.
- Die_preparation wikiPageWikiLink Integrated_circuit.
- Die_preparation wikiPageWikiLink Integrated_circuit_packaging.
- Die_preparation wikiPageWikiLink Micrometre.
- Die_preparation wikiPageWikiLink Preparation_(principle).
- Die_preparation wikiPageWikiLink Semiconductor_device_fabrication.
- Die_preparation wikiPageWikiLink Semiconductor_fabrication.
- Die_preparation wikiPageWikiLink Wafer_(electronics).
- Die_preparation wikiPageWikiLink Wafer_dicing.
- Die_preparation wikiPageWikiLink File:Mounted_wafer.jpg.
- Die_preparation wikiPageWikiLinkText "Die preparation".
- Die_preparation wikiPageWikiLinkText "die preparation".
- Die_preparation wikiPageWikiLinkText "die separation".
- Die_preparation wikiPageWikiLinkText "die".
- Die_preparation wikiPageWikiLinkText "die-cut".
- Die_preparation wikiPageWikiLinkText "scribeline".
- Die_preparation hasPhotoCollection Die_preparation.
- Die_preparation wikiPageUsesTemplate Template:Citation.
- Die_preparation wikiPageUsesTemplate Template:Electronics-stub.
- Die_preparation wikiPageUsesTemplate Template:Engineering-stub.
- Die_preparation wikiPageUsesTemplate Template:Unreferenced.
- Die_preparation subject Category:Semiconductor_device_fabrication.
- Die_preparation hypernym Step.
- Die_preparation type Article.
- Die_preparation type MilitaryConflict.
- Die_preparation type Article.
- Die_preparation type Process.
- Die_preparation type Semiconductor.
- Die_preparation comment "Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.".
- Die_preparation label "Die preparation".
- Die_preparation sameAs ダイシング.
- Die_preparation sameAs m.041hbb.
- Die_preparation sameAs Q5274495.
- Die_preparation sameAs Q5274495.
- Die_preparation wasDerivedFrom Die_preparation?oldid=663094538.
- Die_preparation depiction Mounted_wafer.jpg.
- Die_preparation isPrimaryTopicOf Die_preparation.