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- Dicing_saw abstract "A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material.Dicing saw is a kind of cutting machines. A cutter for use in dicing, and performs the cutting of the silicon wafer. At present, the mainstream cutting of silicon wafers with a diameter of 200mm or 300mm, 0.05mm square cut is also possible.Diamond blade to obscure the industrial diamond in the resin is the mainstream. Also, the thickness of the blades varies by the subject material is of about 20μm ~ 35μm is used when cutting the silicon wafer.Share accounted for 90% in only Japanese companies, such as discos and Accretech (Tokyo Seimitsu). In the past, half-cut to cut 2/3 degree of wafer thickness it was the mainstream, with the large diameter of the wafer size, on top of the tape mount, full cut cutting all the wafer is becoming mainstream. Along with it, before and after the process, from the dicing saw (split the rest of the wafer by pasting roller half pre-cut wafer tape to split chip) (half-cut) ⇒ expanded, the mounter (frame tape (mainly UV curable tape) and paste the wafer at the same time) ⇒ has been changed to a dicing saw (full cut) ⇒UV irradiation.".
- Dicing_saw wikiPageID "4714340".
- Dicing_saw wikiPageLength "1617".
- Dicing_saw wikiPageOutDegree "13".
- Dicing_saw wikiPageRevisionID "676725522".
- Dicing_saw wikiPageWikiLink english.
- Dicing_saw wikiPageWikiLink Category:Saws.
- Dicing_saw wikiPageWikiLink Ceramic.
- Dicing_saw wikiPageWikiLink Crystal.
- Dicing_saw wikiPageWikiLink Diamond_blade.
- Dicing_saw wikiPageWikiLink Diamond_tool.
- Dicing_saw wikiPageWikiLink Diamond_tools.
- Dicing_saw wikiPageWikiLink Diamond_wire.
- Dicing_saw wikiPageWikiLink Disco_Corporation.
- Dicing_saw wikiPageWikiLink Glass.
- Dicing_saw wikiPageWikiLink Saw.
- Dicing_saw wikiPageWikiLink Semiconductor.
- Dicing_saw wikiPageWikiLink Silicon.
- Dicing_saw wikiPageWikiLink Wafer_(electronics).
- Dicing_saw wikiPageWikiLink Wire_saw.
- Dicing_saw wikiPageWikiLinkText "Dicing saw".
- Dicing_saw wikiPageWikiLinkText "dicing saw".
- Dicing_saw auto "yes".
- Dicing_saw date "December 2009".
- Dicing_saw hasPhotoCollection Dicing_saw.
- Dicing_saw wikiPageUsesTemplate Template:Tool-stub.
- Dicing_saw wikiPageUsesTemplate Template:Unreferenced_stub.
- Dicing_saw subject Category:Saws.
- Dicing_saw hypernym Kind.
- Dicing_saw type Article.
- Dicing_saw type Article.
- Dicing_saw type Tool.
- Dicing_saw comment "A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material.Dicing saw is a kind of cutting machines. A cutter for use in dicing, and performs the cutting of the silicon wafer.".
- Dicing_saw label "Dicing saw".
- Dicing_saw sameAs Scie_à_fil_diamanté.
- Dicing_saw sameAs ダイシングソー.
- Dicing_saw sameAs m.0cjqrx.
- Dicing_saw sameAs Q3475717.
- Dicing_saw sameAs Q3475717.
- Dicing_saw wasDerivedFrom Dicing_saw?oldid=676725522.
- Dicing_saw isPrimaryTopicOf Dicing_saw.