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- Deep_reactive-ion_etching abstract "Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios . It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through silicon via's (TSV)'s in advanced 3D wafer level packaging technology .There are two main technologies for high-rate DRIE: cryogenic and Bosch, although the Bosch process is the only recognised production technique. Both Bosch and cryo processes can fabricate 90° (truly vertical) walls, but often the walls are slightly tapered, e.g. 88° ("reentrant") or 92° ("retrograde").Another mechanism is sidewall passivation: SiOxFy functional groups (which originate from sulphur hexafluoride and oxygen etch gases) condense on the sidewalls, and protect them from lateral etching. As a combination of these processes deep vertical structures can be made.".
- Deep_reactive-ion_etching thumbnail Bosch_process_PILLAR.jpg?width=300.
- Deep_reactive-ion_etching wikiPageID "2445044".
- Deep_reactive-ion_etching wikiPageLength "7142".
- Deep_reactive-ion_etching wikiPageOutDegree "34".
- Deep_reactive-ion_etching wikiPageRevisionID "665508346".
- Deep_reactive-ion_etching wikiPageWikiLink Anisotropy.
- Deep_reactive-ion_etching wikiPageWikiLink Aspect_ratio.
- Deep_reactive-ion_etching wikiPageWikiLink Aspect_ratio_(image).
- Deep_reactive-ion_etching wikiPageWikiLink Balance_spring.
- Deep_reactive-ion_etching wikiPageWikiLink Capacitor.
- Deep_reactive-ion_etching wikiPageWikiLink Cartier_(jeweler).
- Deep_reactive-ion_etching wikiPageWikiLink Category:Etching_(microfabrication).
- Deep_reactive-ion_etching wikiPageWikiLink Category:Microtechnology.
- Deep_reactive-ion_etching wikiPageWikiLink Category:Semiconductor_device_fabrication.
- Deep_reactive-ion_etching wikiPageWikiLink Chemical_reaction.
- Deep_reactive-ion_etching wikiPageWikiLink Dynamic_random-access_memory.
- Deep_reactive-ion_etching wikiPageWikiLink Dynamic_random_access_memory.
- Deep_reactive-ion_etching wikiPageWikiLink Etching_(microfab).
- Deep_reactive-ion_etching wikiPageWikiLink Etching_(microfabrication).
- Deep_reactive-ion_etching wikiPageWikiLink Functional_group.
- Deep_reactive-ion_etching wikiPageWikiLink Hairspring.
- Deep_reactive-ion_etching wikiPageWikiLink Integrated_circuit.
- Deep_reactive-ion_etching wikiPageWikiLink Ion.
- Deep_reactive-ion_etching wikiPageWikiLink Isotropic.
- Deep_reactive-ion_etching wikiPageWikiLink Isotropy.
- Deep_reactive-ion_etching wikiPageWikiLink Kelvin.
- Deep_reactive-ion_etching wikiPageWikiLink Microelectromechanical_systems.
- Deep_reactive-ion_etching wikiPageWikiLink Nanometre.
- Deep_reactive-ion_etching wikiPageWikiLink Passivation_(chemistry).
- Deep_reactive-ion_etching wikiPageWikiLink Plasma_etch.
- Deep_reactive-ion_etching wikiPageWikiLink Plasma_etching.
- Deep_reactive-ion_etching wikiPageWikiLink Polytetrafluoroethylene.
- Deep_reactive-ion_etching wikiPageWikiLink Reactive-ion_etching.
- Deep_reactive-ion_etching wikiPageWikiLink Robert_Bosch_GmbH.
- Deep_reactive-ion_etching wikiPageWikiLink Silicon.
- Deep_reactive-ion_etching wikiPageWikiLink Sputter.
- Deep_reactive-ion_etching wikiPageWikiLink Sputtering.
- Deep_reactive-ion_etching wikiPageWikiLink Sulfur_hexafluoride.
- Deep_reactive-ion_etching wikiPageWikiLink Teflon.
- Deep_reactive-ion_etching wikiPageWikiLink Through-silicon_via.
- Deep_reactive-ion_etching wikiPageWikiLink Wafer_(electronics).
- Deep_reactive-ion_etching wikiPageWikiLink Wafer_(semiconductor).
- Deep_reactive-ion_etching wikiPageWikiLink File:Bosch_process_PILLAR.jpg.
- Deep_reactive-ion_etching wikiPageWikiLink File:Bosch_process_sidewall.jpg.
- Deep_reactive-ion_etching wikiPageWikiLinkText "Deep RIE".
- Deep_reactive-ion_etching wikiPageWikiLinkText "Deep reactive-ion etching".
- Deep_reactive-ion_etching wikiPageWikiLinkText "Deep_reactive-ion_etching#Bosch_process".
- Deep_reactive-ion_etching wikiPageWikiLinkText "deep reactive-ion etching".
- Deep_reactive-ion_etching hasPhotoCollection Deep_reactive-ion_etching.
- Deep_reactive-ion_etching wikiPageUsesTemplate Template:Bosch.
- Deep_reactive-ion_etching wikiPageUsesTemplate Template:Refimprove.
- Deep_reactive-ion_etching subject Category:Etching_(microfabrication).
- Deep_reactive-ion_etching subject Category:Microtechnology.
- Deep_reactive-ion_etching subject Category:Semiconductor_device_fabrication.
- Deep_reactive-ion_etching type Article.
- Deep_reactive-ion_etching type Article.
- Deep_reactive-ion_etching type Process.
- Deep_reactive-ion_etching type Semiconductor.
- Deep_reactive-ion_etching comment "Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios .".
- Deep_reactive-ion_etching label "Deep reactive-ion etching".
- Deep_reactive-ion_etching sameAs Reaktives_Ionentiefenätzen.
- Deep_reactive-ion_etching sameAs Gravure_ionique_réactive_profonde.
- Deep_reactive-ion_etching sameAs 深堀りRIE.
- Deep_reactive-ion_etching sameAs m.07dk4j.
- Deep_reactive-ion_etching sameAs Djup_reaktiv_jonetsning.
- Deep_reactive-ion_etching sameAs Q486936.
- Deep_reactive-ion_etching sameAs Q486936.
- Deep_reactive-ion_etching wasDerivedFrom Deep_reactive-ion_etching?oldid=665508346.
- Deep_reactive-ion_etching depiction Bosch_process_PILLAR.jpg.
- Deep_reactive-ion_etching isPrimaryTopicOf Deep_reactive-ion_etching.
