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- Compliant_bonding abstract "Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas in the 1960s. The bond is formed well below the melting point of the mating gold surfaces and is therefore referred to as a solid-state type bond. The compliant bond is formed by transmitting heat and pressure to the bond region through a relatively thick indentable or compliant medium, generally an aluminum tape (Figure 1).".
- Compliant_bonding thumbnail CompliantBondingAGold_wire0001.jpg?width=300.
- Compliant_bonding wikiPageID "38008960".
- Compliant_bonding wikiPageLength "8992".
- Compliant_bonding wikiPageOutDegree "11".
- Compliant_bonding wikiPageRevisionID "678487886".
- Compliant_bonding wikiPageWikiLink Category:American_inventions.
- Compliant_bonding wikiPageWikiLink Category:Integrated_circuits.
- Compliant_bonding wikiPageWikiLink Category:Packaging_(microfabrication).
- Compliant_bonding wikiPageWikiLink Category:Semiconductor_technology.
- Compliant_bonding wikiPageWikiLink Integrated_circuit.
- Compliant_bonding wikiPageWikiLink Thermocompression_bonding.
- Compliant_bonding wikiPageWikiLink Thermosonic_bonding.
- Compliant_bonding wikiPageWikiLink File:CompliantBondingAGold_wire0001.jpg.
- Compliant_bonding wikiPageWikiLink File:Compliant_Bonding_Gold_wires0001.jpg.
- Compliant_bonding wikiPageWikiLink File:Compliant_bonding_wires_simultaneously_of_varying_sizes0001.jpg.
- Compliant_bonding wikiPageWikiLink File:Solid_state_bonding_a_wire_to_a_metallized_surface.jpg.
- Compliant_bonding wikiPageWikiLinkText "Compliant bonding".
- Compliant_bonding hasPhotoCollection Compliant_bonding.
- Compliant_bonding wikiPageUsesTemplate Template:Clear.
- Compliant_bonding wikiPageUsesTemplate Template:Reflist.
- Compliant_bonding wikiPageUsesTemplate Template:Wafer_bonding.
- Compliant_bonding subject Category:American_inventions.
- Compliant_bonding subject Category:Integrated_circuits.
- Compliant_bonding subject Category:Packaging_(microfabrication).
- Compliant_bonding subject Category:Semiconductor_technology.
- Compliant_bonding type Circuit.
- Compliant_bonding comment "Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas in the 1960s. The bond is formed well below the melting point of the mating gold surfaces and is therefore referred to as a solid-state type bond. The compliant bond is formed by transmitting heat and pressure to the bond region through a relatively thick indentable or compliant medium, generally an aluminum tape (Figure 1).".
- Compliant_bonding label "Compliant bonding".
- Compliant_bonding sameAs m.0q3zh82.
- Compliant_bonding sameAs Q5156644.
- Compliant_bonding sameAs Q5156644.
- Compliant_bonding wasDerivedFrom Compliant_bonding?oldid=678487886.
- Compliant_bonding depiction CompliantBondingAGold_wire0001.jpg.
- Compliant_bonding isPrimaryTopicOf Compliant_bonding.