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- Chip-scale_package abstract "A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC’s standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale package (WL-CSP).".
- Chip-scale_package thumbnail UNIO_WLCSP_and_SOT23_Device_on_Penny.jpg?width=300.
- Chip-scale_package wikiPageExternalLink ChapterD.htm.
- Chip-scale_package wikiPageExternalLink archives.
- Chip-scale_package wikiPageExternalLink chip-scale-package.
- Chip-scale_package wikiPageID "2036147".
- Chip-scale_package wikiPageLength "2331".
- Chip-scale_package wikiPageOutDegree "14".
- Chip-scale_package wikiPageRevisionID "658958227".
- Chip-scale_package wikiPageWikiLink Ball_grid_array.
- Chip-scale_package wikiPageWikiLink Category:Chip_carriers.
- Chip-scale_package wikiPageWikiLink Die_(integrated_circuit).
- Chip-scale_package wikiPageWikiLink Flip_chip.
- Chip-scale_package wikiPageWikiLink Fujitsu.
- Chip-scale_package wikiPageWikiLink Hitachi_Cable.
- Chip-scale_package wikiPageWikiLink IPC_(electronics).
- Chip-scale_package wikiPageWikiLink Integrated_circuit.
- Chip-scale_package wikiPageWikiLink Interposer.
- Chip-scale_package wikiPageWikiLink JEDEC.
- Chip-scale_package wikiPageWikiLink Mitsubishi_Electric.
- Chip-scale_package wikiPageWikiLink Silicon_wafer.
- Chip-scale_package wikiPageWikiLink Wafer-level_packaging.
- Chip-scale_package wikiPageWikiLink Wafer_(electronics).
- Chip-scale_package wikiPageWikiLink File:UNIO_WLCSP_and_SOT23_Device_on_Penny.jpg.
- Chip-scale_package wikiPageWikiLinkText "CSP".
- Chip-scale_package wikiPageWikiLinkText "Chip-scale package".
- Chip-scale_package wikiPageWikiLinkText "chip-scale package".
- Chip-scale_package hasPhotoCollection Chip-scale_package.
- Chip-scale_package wikiPageUsesTemplate Template:Commons_category-inline.
- Chip-scale_package wikiPageUsesTemplate Template:Electronics-stub.
- Chip-scale_package wikiPageUsesTemplate Template:Reflist.
- Chip-scale_package wikiPageUsesTemplate Template:Semiconductor_packages.
- Chip-scale_package subject Category:Chip_carriers.
- Chip-scale_package hypernym Package.
- Chip-scale_package type Software.
- Chip-scale_package comment "A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging.".
- Chip-scale_package label "Chip-scale package".
- Chip-scale_package sameAs Chip_Scale_Package.
- Chip-scale_package sameAs m.06gr5_.
- Chip-scale_package sameAs Chip-scale_package.
- Chip-scale_package sameAs Q5101572.
- Chip-scale_package sameAs Q5101572.
- Chip-scale_package sameAs 晶片尺寸封裝.
- Chip-scale_package wasDerivedFrom Chip-scale_package?oldid=658958227.
- Chip-scale_package depiction UNIO_WLCSP_and_SOT23_Device_on_Penny.jpg.
- Chip-scale_package isPrimaryTopicOf Chip-scale_package.