Matches in DBpedia 2016-04 for { <http://dbpedia.org/resource/Three-dimensional_integrated_circuit> ?p ?o }
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "3D stacking".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "3D-stacked".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "Three-dimensional integrated circuit".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "die-stacked".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "third dimension".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "three dimensional chips".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "three dimensional".
- Three-dimensional_integrated_circuit wikiPageWikiLinkText "three-dimensional integrated circuit".
- Three-dimensional_integrated_circuit wikiPageUsesTemplate Template:Cite_web.
- Three-dimensional_integrated_circuit wikiPageUsesTemplate Template:Emerging_technologies.
- Three-dimensional_integrated_circuit wikiPageUsesTemplate Template:Refbegin.
- Three-dimensional_integrated_circuit wikiPageUsesTemplate Template:Refend.
- Three-dimensional_integrated_circuit wikiPageUsesTemplate Template:Reflist.
- Three-dimensional_integrated_circuit subject Category:Emerging_technologies.
- Three-dimensional_integrated_circuit subject Category:Integrated_circuits.
- Three-dimensional_integrated_circuit subject Category:Packaging_(microfabrication).
- Three-dimensional_integrated_circuit subject Category:Semiconductor_device_fabrication.
- Three-dimensional_integrated_circuit hypernym Circuit.
- Three-dimensional_integrated_circuit type BaseballLeague.
- Three-dimensional_integrated_circuit type Circuit.
- Three-dimensional_integrated_circuit type Page.
- Three-dimensional_integrated_circuit type Process.
- Three-dimensional_integrated_circuit type Redirect.
- Three-dimensional_integrated_circuit type Semiconductor.
- Three-dimensional_integrated_circuit comment "In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.".
- Three-dimensional_integrated_circuit label "Three-dimensional integrated circuit".
- Three-dimensional_integrated_circuit sameAs Q229370.
- Three-dimensional_integrated_circuit sameAs 3D-Integration.
- Three-dimensional_integrated_circuit sameAs m.03m6bzn.
- Three-dimensional_integrated_circuit sameAs Q229370.
- Three-dimensional_integrated_circuit sameAs 三維晶片.
- Three-dimensional_integrated_circuit wasDerivedFrom Three-dimensional_integrated_circuit?oldid=702699621.
- Three-dimensional_integrated_circuit depiction 3DS_die_stacking_concept_model.PNG.
- Three-dimensional_integrated_circuit isPrimaryTopicOf Three-dimensional_integrated_circuit.