Matches in DBpedia 2016-04 for { ?s ?p "In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is \"flat pack\". Chip carriers are smaller than dual in-line packages and since they use all four edges of the package can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are proprietary to one or two manufacturers. Sometimes the term \"chip carrier\" is used to refer generically to any package for an integrated circuit.Types of chip-carrier package are usually referred to by initialisms and include: BCC: Bump Chip Carrier CLCC: Ceramic Leadless Chip Carrier Leadless chip carrier (LCC): Leadless Chip Carrier, contacts are recessed vertically. LCC: Leaded Chip Carrier LCCC: Leaded Ceramic Chip Carrier DLCC: Dual Lead-Less Chip Carrier (Ceramic) PLCC: Plastic Leaded Chip Carrier PoP: Package on package↑ ↑ 2.0 2.1 ↑ 3.0 3.1 3.2 3.3 3.4 3.5 ↑ 4.0 4.1"@en }
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- Chip_carrier abstract "In electronics, a chip carrier is one of several kinds of surface mount technology packages for integrated circuits. Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is \"flat pack\". Chip carriers are smaller than dual in-line packages and since they use all four edges of the package can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are proprietary to one or two manufacturers. Sometimes the term \"chip carrier\" is used to refer generically to any package for an integrated circuit.Types of chip-carrier package are usually referred to by initialisms and include: BCC: Bump Chip Carrier CLCC: Ceramic Leadless Chip Carrier Leadless chip carrier (LCC): Leadless Chip Carrier, contacts are recessed vertically. LCC: Leaded Chip Carrier LCCC: Leaded Ceramic Chip Carrier DLCC: Dual Lead-Less Chip Carrier (Ceramic) PLCC: Plastic Leaded Chip Carrier PoP: Package on package↑ ↑ 2.0 2.1 ↑ 3.0 3.1 3.2 3.3 3.4 3.5 ↑ 4.0 4.1".