Matches in DBpedia 2016-04 for { ?s ?p "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints."@en }
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- Bead_probe_technology abstract "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.".
- Q4876056 abstract "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.".
- Bead_probe_technology comment "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.".
- Q4876056 comment "Bead probe technology (BPT) is technique used to provide electrical access (called “nodal access”) to printed circuit board (PCB) circuitry for performing in-circuit testing (ICT). It makes use of small beads of solder placed onto the board's traces to allow measuring and controlling of the signals using a test probe. This permits test access to boards on which standard ICT test pads are not feasible due to space constraints.".