Matches in DBpedia 2015-10 for { ?s ?p "A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting."@en }
Showing triples 1 to 1 of
1
with 100 triples per page.
- Ball_grid_array abstract "A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.".